B24B 37/345
Feeding, loading or unloading work specially adapted to lapping
Official title: {Feeding, loading or unloading work specially adapted to lapping}
B24B37/345 (Feeding, loading or unloading work specially adapted to lapping) appears on 422 US grants and 361 published applications in this corpus.
Search patents in B24B- Granted patents
- 422
- Published applications
- 361
- Assignees
- 135
- Inventors
- 884
- Latest grant
- 5 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 3 | 0 |
| 1991 | 1 | 0 |
| 1992 | 3 | 0 |
| 1993 | 4 | 0 |
| 1994 | 5 | 0 |
| 1995 | 1 | 0 |
| 1996 | 5 | 0 |
| 1997 | 10 | 0 |
| 1998 | 10 | 0 |
| 1999 | 16 | 0 |
| 2000 | 28 | 0 |
| 2001 | 27 | 23 |
| 2002 | 51 | 22 |
| 2003 | 20 | 23 |
| 2004 | 20 | 21 |
| 2005 | 25 | 25 |
| 2006 | 19 | 19 |
| 2007 | 19 | 21 |
| 2008 | 6 | 12 |
| 2009 | 7 | 16 |
| 2010 | 7 | 6 |
| 2011 | 11 | 11 |
| 2012 | 9 | 6 |
| 2013 | 9 | 9 |
| 2014 | 9 | 13 |
| 2015 | 5 | 12 |
| 2016 | 14 | 10 |
| 2017 | 7 | 10 |
| 2018 | 5 | 12 |
| 2019 | 7 | 9 |
| 2020 | 11 | 8 |
| 2021 | 6 | 10 |
| 2022 | 4 | 15 |
| 2023 | 8 | 9 |
| 2024 | 9 | 9 |
| 2025 | 12 | 15 |
| 2026 | 3 | 15 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Apparatus and methods for chemical mechanical polishing21 Oct 2025US 12,447,580 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Substrate processing apparatus24 Sep 2026US 2026/0293593 A1Ebara Corporation
- Substrate processing apparatus including catalyst pad27 Aug 2026US 2026/0255909 A1Samsung Electronics Co., Ltd.
- High throughput polishing modules and modular polishing systems27 Aug 2026US 2026/0255918 A1APPLIED Materials.Inc.
- Substrate processing apparatus20 Aug 2026US 2026/0241510 A1Ebara Corporation
- Substrate polishing system23 Jul 2026US 2026/0208316 A1Kctech Co., Ltd.
Most cited
By later US patents
- Continuous processing system for chemical mechanical polishing501US 5,738,574 AAPPLIED Materials.Inc. · 1998
- Transfer module for bowed wafers397US 9,355,882 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Wafer polishing method and apparatus209US 5,329,732 ASpeedfam Corporation · 1994
- Wafer polishing method and apparatus157US 5,498,199 ASpeedfam Corporation · 1996
- Apparatus for separating wafers from polishing pads used in chemical-mechanical planarization of semiconductor wafers134US 5,658,190 AMicron Technology, Inc. · 1997