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US 2026/0241510 A1Published application
Substrate processing apparatus
AssigneeEbara Corporation
InventorsMitsuru MIYAZAKI, Hiroshi SOTOZAKI
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Abstract
A substrate processing apparatus capable of optimizing a measurement process is disclosed. The substrate processing apparatus includes a load/unload unit arranging load ports side by side adjacent to a front outer wall of a housing, and an upper measurement module and a lower measurement module configured to measure a surface condition of a substrate, and disposed side by side vertically adjacent to a side outer wall of the housing connected to the front outer wall.
Claims10
A substrate processing apparatus comprising:
- a polishing module configured to polish a substrate;
- a cleaning module configured to clean the substrate;
- a drying module configured to dry the cleaned substrate;
- a plurality of load ports configured to mount a transport container for storing the substrate;
- at least one transport robot disposed within a housing, and configured to transport the substrate before polishing to the polishing module and transport the substrate dried in the drying module to the transport container;
- a load/unload unit arranging the load ports side by side adjacent to a front outer wall of the housing;
- and
- an upper measurement module and a lower measurement module configured to measure surface condition of the substrate, and disposed side by side vertically adjacent to a side outer wall of the housing connected to the front outer wall.
5 more elements
Dependencies are inferred from the claim text.