Substrate processing apparatus

A substrate processing apparatus comprising:

• a plurality of polishing modules each configured to polish a substrate, the plurality of polishing modules being located in a polishing level;
• a post-processing lane configured to perform post-processing including cleaning and drying of the polished substrate, the post-processing lane being located in a post-processing level;
• and
• an elevating transporter configured to remove the polished substrate from one of the plurality of polishing modules and transport the polished substrate directly to the post-processing lane,
• wherein the post-processing level is an upper level located above the polishing level or a lower level located below the polishing level,
• the elevating transporter is located at the same distance from the plurality of polishing modules, and
• the elevating transporter includes a holding hand configured to hold the substrate and an elevating mechanism configured to elevate and lower the holding hand between the polishing level and the post-processing level.