B24B 37/34
Accessories
B24B37/34 (Accessories) appears on 648 US grants and 667 published applications in this corpus.
Search patents in B24B- Granted patents
- 648
- Published applications
- 667
- Assignees
- 196
- Inventors
- 1,424
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 3 | 0 |
| 1991 | 1 | 0 |
| 1992 | 3 | 0 |
| 1993 | 4 | 0 |
| 1994 | 5 | 0 |
| 1995 | 1 | 0 |
| 1996 | 7 | 0 |
| 1997 | 11 | 0 |
| 1998 | 10 | 0 |
| 1999 | 19 | 0 |
| 2000 | 31 | 0 |
| 2001 | 33 | 24 |
| 2002 | 55 | 24 |
| 2003 | 23 | 25 |
| 2004 | 23 | 25 |
| 2005 | 26 | 28 |
| 2006 | 21 | 22 |
| 2007 | 24 | 24 |
| 2008 | 10 | 17 |
| 2009 | 9 | 19 |
| 2010 | 10 | 11 |
| 2011 | 14 | 12 |
| 2012 | 10 | 11 |
| 2013 | 10 | 17 |
| 2014 | 15 | 26 |
| 2015 | 11 | 34 |
| 2016 | 19 | 19 |
| 2017 | 19 | 30 |
| 2018 | 16 | 34 |
| 2019 | 27 | 27 |
| 2020 | 28 | 36 |
| 2021 | 14 | 26 |
| 2022 | 26 | 38 |
| 2023 | 28 | 43 |
| 2024 | 33 | 30 |
| 2025 | 26 | 40 |
| 2026 | 17 | 25 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- System and method for controlling chemical mechanical planarization29 Sep 2026US 12,751,254 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Polishing apparatus for substrate and polishing method for substrate using the same1 Sep 2026US 12,722,250 B2Samsung Electronics Co., Ltd.
- Chemical mechanical polishing temperature scanning apparatus for temperature control14 Jul 2026US 12,678,912 B2APPLIED Materials.Inc.
- Calibration method for acoustic sensor26 May 2026US 12,638,422 B2Ebara Corporation
- Methods for polishing bulk silicon devices5 May 2026US 12,622,195 B2Qorvo US, Inc.
- Chemical mechanical polishing temperature scanning apparatus for temperature control8 Oct 2026US 2026/0307202 A1APPLIED Materials.Inc.
- Substrate processing apparatus24 Sep 2026US 2026/0293593 A1Ebara Corporation
- Polishing apparatus and polishing table10 Sep 2026US 2026/0264195 A1Micro Engineering Inc.
- Substrate processing device and substrate processing method27 Aug 2026US 2026/0249419 A1Ebara Corporation
- Substrate processing apparatus including catalyst pad27 Aug 2026US 2026/0255909 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Continuous processing system for chemical mechanical polishing501US 5,738,574 AAPPLIED Materials.Inc. · 1998
- Transfer module for bowed wafers397US 9,355,882 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Wafer polishing method and apparatus209US 5,329,732 ASpeedfam Corporation · 1994
- Wafer polishing method and apparatus157US 5,498,199 ASpeedfam Corporation · 1996
- Apparatus for separating wafers from polishing pads used in chemical-mechanical planarization of semiconductor wafers134US 5,658,190 AMicron Technology, Inc. · 1997