Polishing apparatus and polishing table

Abstract

There is provided a polishing processing apparatus capable of effectively preventing deformation (thermal deformation) of a polishing platen of a CMP apparatus, further improving the SFOR of a substrate surface and the like, and stably performing polishing processing for a large number of pieces with high quality. A polishing table 11 includes a polishing platen 1 having a surface on which a polishing pad is disposed, a cooling base 2 on which the polishing platen is placed, and that has first grooves formed in a surface that contacts a rear surface of the polishing platen, and a decompression cooling mechanism 200 that supplies a temperature-controlled negative pressure fluid to the first grooves 21 of the cooling base to simultaneously perform suction and cooling of the polishing platen, collects the negative pressure fluid that has passed through the first grooves to perform chiller treatment, and supplies the negative pressure fluid to the first grooves again. The decompression cooling mechanism includes a vacuum pump 70 that generates the negative pressure fluid, a chiller device 62 that performs chiller cooling of the negative pressure fluid, and a fluid pump 61 that supplies the temperature-controlled negative pressure fluid to the first grooves.

Dependencies are inferred from the claim text.