High throughput polishing modules and modular polishing systems

A polishing system, comprising:

• a first portion comprising one or more cleaning systems and one or more system loading stations, wherein the first portion comprises a first end, and the one or more cleaning systems are disposed between the first end and the one or more system loading stations;
• a plurality of polishing modules, each individual polishing module of the plurality of polishing modules having a first side and a second side which is opposite to the first side, each polishing module comprising:
• a polishing platen positioned adjacent to the first side and rotatable around a platen central axis;
• a carrier loading station positioned adjacent to the second side, each carrier loading station having a loading station central axis;
• and
• a substrate carrier transport system positioned between the polishing platen and the carrier loading station and configured to move a first substrate carrier assembly and a second substrate carrier assembly between the polishing platen and the carrier loading station, each substrate carrier transport system having a carrier support module, each carrier support module suspended from a frame, and each carrier support module comprising a carrier platform comprising the first substrate carrier assembly and the second substrate carrier assembly, the carrier platform is rotatable about a platform axis by a platform actuator configured to rotate the first and second substrate carrier assemblies between either a first processing mode position or a second processing mode position,
• wherein
• a first polishing module of the plurality of polishing modules is directly adjacent to a second polishing module of the plurality of polishing modules,
• the first side of the first polishing module and the first side of the second polishing module are adjacent to the first end,
• a third polishing module of the plurality of polishing modules is directly adjacent to a fourth polishing module of the plurality of polishing modules,
• the second side of the first polishing module is positioned directly adjacent the second side of the third polishing module, and
• the second side of the second polishing module is positioned directly adjacent the second side of the fourth polishing module;
• and
• a substrate handler positioned directly adjacent to each carrier loading station within each of the first, second, third and fourth polishing modules.

A polishing system comprising:

• a plurality of polishing modules having at least a first polishing module and a second polishing module coupled together in a side-by-side arrangement and supported by a shared tabletop, and a third polishing module and a fourth polishing module coupled together in a side-by-side arrangement, each polishing module comprising:
• a polishing processing region;
• a carrier support module comprising:
• a carrier platform comprising a first substrate carrier assembly and a second carrier assembly, wherein
• the carrier platform is rotatable or pivotable about a platform axis by a platform actuator configured to rotate the first and second substrate carrier assemblies between either a first processing mode position or a second processing mode position,
• the platform actuator is configured to rotate the carrier platform, the first carrier assembly, and the second carrier assembly together, and
• each of the first carrier assembly and the second carrier assembly comprise:
• a carrier head comprising a chamber and coupled to a carrier shaft;
• and
• a rotation actuator coupled to the carrier shaft, and configured to rotate the carrier shaft and the carrier head;
• a carrier loading station for transferring substrates to and from each one of the carrier heads, wherein the carrier loading station also comprises a buffing station and a metrology station;
• a polishing station comprising a polishing platen configured to support a polishing pad, wherein the carrier support module is positioned to move the first substrate carrier assembly and the second carrier assembly between a substrate polishing position disposed above the polishing platen and a substrate transfer position disposed above the carrier loading station;
• a substrate handler disposed between each polishing module of the plurality of polishing modules and adjacent each carrier loading station;
• and
• a substrate transfer station disposed between the first polishing module and the second polishing module of the plurality of polishing modules and adjacent to the polishing stations, wherein the substrate handler is configured to transfer substrates between the each individual carrier loading station,
• wherein the first polishing module, the second polishing module, the third polishing module, and the fourth polishing module each have a first side and a second side which is opposite to the first side, and
• wherein
• the first polishing module of the plurality of polishing modules is directly adjacent to the second polishing module of the plurality of polishing modules,
• the third polishing module of the plurality of polishing modules is directly adjacent to the fourth polishing module of the plurality of polishing modules, and
• the second side of the first polishing module is positioned directly adjacent the second side of the third polishing module, and
• the second side of the second polishing module is positioned directly adjacent the second side of the fourth polishing module, and
• wherein in each polishing module:
• the polishing platen is positioned adjacent to the first side;
• the carrier loading station is positioned adjacent to the second side;
• the carrier support module is positioned between the polishing platen and the carrier loading station.