B24B 21/004
Machines or devices using grinding or polishing belts: using abrasive rolled strips
Official title: {using abrasive rolled strips}
B24B21/004 (Machines or devices using grinding or polishing belts: using abrasive rolled strips) appears on 156 US grants and 106 published applications in this corpus.
Search patents in B24B- Granted patents
- 156
- Published applications
- 106
- Assignees
- 88
- Inventors
- 289
- Latest grant
- 3 Jun 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 7 | 0 |
| 1992 | 3 | 0 |
| 1993 | 3 | 0 |
| 1994 | 3 | 0 |
| 1995 | 5 | 0 |
| 1996 | 6 | 0 |
| 1997 | 4 | 0 |
| 1998 | 7 | 0 |
| 1999 | 10 | 0 |
| 2000 | 6 | 0 |
| 2001 | 9 | 4 |
| 2002 | 11 | 4 |
| 2003 | 7 | 8 |
| 2004 | 3 | 5 |
| 2005 | 6 | 1 |
| 2006 | 3 | 2 |
| 2007 | 4 | 4 |
| 2008 | 0 | 5 |
| 2009 | 1 | 6 |
| 2010 | 0 | 6 |
| 2011 | 2 | 5 |
| 2012 | 4 | 4 |
| 2013 | 2 | 1 |
| 2014 | 2 | 6 |
| 2015 | 4 | 4 |
| 2016 | 4 | 2 |
| 2017 | 7 | 9 |
| 2018 | 8 | 5 |
| 2019 | 6 | 10 |
| 2020 | 1 | 3 |
| 2021 | 2 | 4 |
| 2022 | 5 | 0 |
| 2023 | 1 | 1 |
| 2024 | 2 | 2 |
| 2025 | 2 | 5 |
By publication year. Applications have been published since 2001.
Recent patents
- Polishing apparatus and polishing method3 Jun 2025US 12,318,888 B2Kioxia Corporation
- Method for controlling repairing apparatus and repairing apparatus14 Jan 2025US 12,194,593 B2Chongqing Hkc Optoelectronics Technology Co., Ltd.
- Outer diameter cleaning and sanding drill attachment10 Sep 2024US 12,083,650 B2
- Polishing apparatus9 Jan 2024US 11,865,665 B2Ebara Corporation
- Substrate processing apparatus and substrate processing method6 Jun 2023US 11,667,008 B2Ebara Corporation
- Surface Processing Tool and Surface Processing Machine Equipped Therewith28 Aug 2025US 2025/0269485 A1H. Günther Falkenrich GmbH
- Substrate processing apparatus17 Jul 2025US 2025/0229378 A1Ebara Corporation
- Substrate polishing method5 Jun 2025US 2025/0178150 A1Ebara Corporation
- Polishing head and polishing apparatus22 May 2025US 2025/0162100 A1Ebara Corporation
- Polishing head and polishing apparatus27 Mar 2025US 2025/0100103 A1Ebara Corporation
Most cited
By later US patents
- Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies182US 6,039,633 AMicron Technology, Inc. · 2000
- Method and apparatus for controlling planarizing characteristics in mechanical and chemical-mechanical planarization of microelectronic substrates166US 5,997,384 AMicron Technology, Inc. · 1999
- Endpoint detection apparatus, planarizing machines with endpointing apparatus, and endpointing methods for mechanical or chemical-mechanical planarization of microelectronic substrate assemblies129US 6,234,878 B1Micron Technology, Inc. · 2001
- Polishing machine having a taut microabrasive strip and an improved wafer support head126US 5,335,453 ACommissariat A L' Energie Atomique · 1994
- Endpoint detection apparatus, planarizing machines with endpointing apparatus, and endpointing methods for mechanical or chemical-mechanical planarization of microelectronic substrate assemblies117US 6,206,754 B1Micron Technology, Inc. · 2001