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US 5,335,453 AGranted
Polishing machine having a taut microabrasive strip and an improved wafer support head
AssigneeCommissariat a l'Energie Atomique
InventorsAndre Baldy, Gerard Barrois, Henri Blanc, Marcel Dominiak
Life of this patent
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Abstract
A polishing machine having a taut microabrasive sheet. The machine includes a machine polishing disk in the form of a planar reference disk and a microabrasive sheet held taut on the disk by an appropriate mechanism. The mechanism for holding the microabrasive sheet taut can be a delivery roll and a receiving roll. The machine can be applied to the polishing of silicon wafers containing integrated components and in particular magnetic read-write heads.
Claims14
A polishing machine comprising:
- a taut microabrasive strip positioned above a rigid planar upper face of a fixed polishing disk between a delivery roll and a receiving roll, the delivery roll comprising means for exerting thereon a resistant torque, and the receiving roll being controlled by a motor;
- a support head for supporting a sample to be polished with a face of the sample to be polished facing the abrasive strip, the sample support head comprising a rigid part and a flexible disk made from a flexible material having a certain thickness, said flexible disk being fixed to said rigid part and receiving said sample to be polished;
- and
- means for displacing the sample support head in a circular translatory movement, the rigid part of the sample support head being connected by a self-aligning bearing and a vertical shaft to said displacing means.
1 more element
Dependencies are inferred from the claim text.