Polishing apparatus and polishing method
AssigneeKioxia Corporation
InventorsTakeshi Kikuchi, Takayuki Nakayama, Masayoshi Adachi, Daisuke Sugiyama
Life of this patent
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Abstract
A polishing apparatus is configured to polish a peripheral edge of an object. The apparatus includes: a stage having a mounting surface to mount the object; a polishing head configured to press a polishing surface against the peripheral edge and polish the peripheral edge; a first inlet configured to supply liquid to the polishing surface; and a protector having a first surface extending along a first direction intersecting with the mounting surface, the first surface having an opening between the stage and the polishing head in a second direction intersecting with the first direction.
Claims17
A polishing apparatus configured to polish a peripheral edge of an object, the apparatus comprising:
- a stage having a mounting surface to mount the object;
- a polishing head configured to press a polishing surface against the peripheral edge and polish the peripheral edge;
- a first inlet configured to supply liquid to the polishing surface;
- and
- a protector having a first surface extending along a first direction intersecting with the mounting surface, the first surface having an opening between the stage and the polishing head in a second direction intersecting with the first direction,
- wherein:
- the polishing surface is provided on a polishing tape having a first opening;
- and
- the polishing head has a second opening connected to the first inlet and extending through the polishing head in the second direction.
A polishing apparatus configured to polish a peripheral edge of an object, the apparatus comprising:
- a stage having a mounting surface to mount the object;
- a polishing head configured to press a polishing surface against the peripheral edge and polish the peripheral edge;
- a first inlet configured to supply liquid to the polishing surface;
- and
- a protector having
- a front surface extending along a first direction intersecting with the mounting surface, the front surface having an opening between the stage and the polishing head in a second direction intersecting with the first direction,
- a first side surface extending along the second direction, and
- a second side surface extending along the second direction,
- the polishing head is provided between the first side surface and the second side surface in a third direction intersecting the second direction,
- wherein the protector further has
- an upper surface provided above the polishing head and having the first inlet, and
- a lower surface provided under the polishing head.
A polishing apparatus configured to polish a peripheral edge of an object, the apparatus comprising:
- a stage having a mounting surface to mount the object;
- a polishing head configured to press a polishing surface against the peripheral edge and polish the peripheral edge;
- a first inlet configured to supply liquid to the polishing surface;
- and
- a protector having
- a front surface extending along a first direction intersecting with the mounting surface, the front surface having an opening between the stage and the polishing head in a second direction intersecting with the first direction,
- a first side surface extending along the second direction, and
- a second side surface extending along the second direction,
- the polishing head is provided between the first side surface and the second side surface in a third direction intersecting the second direction,
- wherein:
- the polishing surface is provided on a polishing tape having a first opening;
- and
- the polishing head has a second opening connected to the first inlet and extending through the polishing head in the second direction.
A polishing method for polishing a peripheral edge of an object, the polishing method comprising:
- mounting the object onto a mounting surface of a stage;
- supplying a liquid onto a polishing surface;
- and
- pressing the polishing surface against the peripheral edge by a polishing head through a protector, and polishing the peripheral edge, the protector having a first surface extending along a first direction intersecting with the mounting surface, the first surface having an opening between the stage and the polishing head in a second direction intersecting with the first direction,
- wherein
- the liquid is supplied onto a polishing surface without the liquid being supplied onto a surface of the object on which a pattern is formed.
Dependencies are inferred from the claim text.