US 11,667,008 B2Granted

Substrate processing apparatus and substrate processing method

AssigneeEbara Corporation

InventorHokuto Yamanobe

Life of this patent

Estimating the term…

Abstract

A substrate processing apparatus which reliably prevents a cleaning liquid containing foreign particles from falling from a polishing head onto a substrate is disclosed. The substrate processing apparatus includes a rotating and holding mechanism, a polishing head, and a head cleaning device configured to supply the cleaning liquid to the polishing head to clean the polishing head during polishing and/or after polishing of the substrate.

Claims16

Dependent claims

A substrate processing apparatus comprising:

a rotating and holding mechanism configured to hold and rotate a substrate;
a polishing head configured to press a polishing tool against a peripheral portion of the substrate to polish the peripheral portion of the substrate;
a head cleaning device configured to supply a cleaning liquid to the polishing head to clean the polishing head after polishing of the substrate, the head cleaning device being arranged above the polishing head, and supplies the cleaning liquid to the polishing head from directly above the polishing head,
wherein the head cleaning device comprises a cleaning nozzle arranged so as to face the polishing head, and the cleaning nozzle is arranged vertically downward above the polishing head;
and
an operation controller configured to at least cause:
rotation of the rotating and holding mechanism;
pressing the polishing tools against a peripheral portion of the substrate while the rotation and holding mechanism rotates a held substrate;
cause a motor to tilt the polishing head below the substrate after stopping the rotation and pressing;
and
supplying cleaning liquid from the head cleaning device to the polishing head when the polishing head is tilted below the substrate,
a suction device to suck the cleaning liquid adhering to the polishing head, wherein the suction device sucks the cleaning liquid adhering the polishing head to remove the cleaning liquid after the head cleaning device supplies the cleaning liquid to the polishing head,
and wherein the polishing head comprises a head cover attached to the surface, wherein the suction device comprises a suction line connected to the head cover, the suction line comprising an on-off valve wherein the on-off valve opens and closes the suction line,
wherein a plurality of grooves are formed on a surface of the head cover, wherein a plurality of suction holes are formed in each of the plurality of grooves, and wherein the suction line is coupled to each of suction holes.

11 more elements

A substrate processing method comprising:

rotating a substrate while holding the substrate;
pressing a polishing tool against a peripheral portion of the substrate to polish the peripheral portion of the substrate;
stopping the rotating of the substrate and tilting the polishing head below the substrate;
supplying a cleaning liquid to a polishing head to clean the polishing head during polishing and/or after polishing of the substrate,
wherein the supplying a cleaning liquid comprising supplying the cleaning liquid to the polishing head from a cleaning nozzle arranged directly above and vertically downward from the polishing head, and
supplying the cleaning liquid to the polishing head when the polishing head is arranged below the substrate after polishing of the substrate,
sucking the cleaning liquid adhering to the polishing head, wherein a suction device sucks the cleaning liquid adhering the polishing head to remove the cleaning liquid after a head cleaning device supplies the cleaning liquid to the polishing head,
and wherein the polishing head comprises a head cover attached to the surface, wherein the suction device comprises a suction line connected to the head cover, the suction line comprising an on-off valve wherein the on-off valve opens and closes the suction line,
wherein a plurality of grooves are formed on a surface of the head cover, wherein a plurality of suction holes are formed in each of the plurality of grooves, and wherein the suction line is coupled to each of suction holes.

6 more elements

Dependencies are inferred from the claim text.

Facts

Application: 17/337,731Filed 3 Jun 2021
Priority: JP JP2020-11049126 Jun 2020
Published: US 2021/0402562 A130 Dec 2021
Granted: 6 Jun 2023
Term ends: Not estimatedThe source records don’t support an estimate.

Classification15 codes

B08B 1/30
Cleaning by methods involving the use of tools: by movement of cleaning members over a surface
B24B 53/017
Devices or means for dressing or conditioning abrasive surfaces: devices or means for dressing, cleaning or otherwise conditioning lapping tools
B24B 9/065
Of non-metallic inorganic material, e.g. stone, ceramics, porcelain: of thin, brittle parts, e.g. semiconductors, wafers
B24B 21/002
Machines or devices using grinding or polishing belts ; Accessories therefor: for grinding edges or bevels

Family

US 2021/0402562 A1Pre-grant publication · published 30 Dec 2021
US 11,667,008 B2This patent

From the US filing history. Foreign family members aren’t listed.

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Abstract

A substrate processing apparatus comprising:

a rotating and holding mechanism configured to hold and rotate a substrate;
a polishing head configured to press a polishing tool against a peripheral portion of the substrate to polish the peripheral portion of the substrate;
a head cleaning device configured to supply a cleaning liquid to the polishing head to clean the polishing head after polishing of the substrate, the head cleaning device being arranged above the polishing head, and supplies the cleaning liquid to the polishing head from directly above the polishing head,
wherein the head cleaning device comprises a cleaning nozzle arranged so as to face the polishing head, and the cleaning nozzle is arranged vertically downward above the polishing head;
and
an operation controller configured to at least cause:
rotation of the rotating and holding mechanism;
pressing the polishing tools against a peripheral portion of the substrate while the rotation and holding mechanism rotates a held substrate;
cause a motor to tilt the polishing head below the substrate after stopping the rotation and pressing;
and
supplying cleaning liquid from the head cleaning device to the polishing head when the polishing head is tilted below the substrate,
a suction device to suck the cleaning liquid adhering to the polishing head, wherein the suction device sucks the cleaning liquid adhering the polishing head to remove the cleaning liquid after the head cleaning device supplies the cleaning liquid to the polishing head,
and wherein the polishing head comprises a head cover attached to the surface, wherein the suction device comprises a suction line connected to the head cover, the suction line comprising an on-off valve wherein the on-off valve opens and closes the suction line,
wherein a plurality of grooves are formed on a surface of the head cover, wherein a plurality of suction holes are formed in each of the plurality of grooves, and wherein the suction line is coupled to each of suction holes.

11 more elements

Facts

Application

17/337,731Filed 3 Jun 2021

Priority

JP JP2020-11049126 Jun 2020

Published

US 2021/0402562 A130 Dec 2021

Granted

6 Jun 2023

Term ends

Not estimatedThe source records don’t support an estimate.

Classification15 codes

B08B 1/30
Cleaning by methods involving the use of tools: by movement of cleaning members over a surface
B24B 53/017
Devices or means for dressing or conditioning abrasive surfaces: devices or means for dressing, cleaning or otherwise conditioning lapping tools
B24B 9/065
Of non-metallic inorganic material, e.g. stone, ceramics, porcelain: of thin, brittle parts, e.g. semiconductors, wafers
B24B 21/002
Machines or devices using grinding or polishing belts ; Accessories therefor: for grinding edges or bevels