Polishing head and polishing apparatus
AssigneeEbara Corporation
InventorsMakoto KASHIWAGI, Mao FUJISAWA
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Abstract
The present invention relates to a polishing head for pressing a polishing tape against a substrate, such as a wafer. The present invention further relates to a polishing apparatus for polishing a substrate with such a polishing head. The polishing head (10) includes a pressing mechanism (12) configured to press a polishing tape (2) against a substrate W, and a tape hook (40) configured to restrict movement of an edge of the polishing tape (2) in a direction toward the substrate (W). The tape hook (40) has a tape positioning surface (47) that faces a polishing surface of the edge of the polishing tape (2).
Claims9
A polishing head for polishing a substrate, comprising:
- a pressing mechanism configured to press a polishing tape against the substrate;
- and
- a tape hook configured to restrict movement of an edge of the polishing tape in a direction toward the substrate, the tape hook having a tape positioning surface that faces a polishing surface of the edge of the polishing tape.
Dependencies are inferred from the claim text.