B23K 35/3615
N-compounds
Official title: {N-compounds}
B23K35/3615 (N-compounds) appears on 108 US grants and 74 published applications in this corpus.
Search patents in B23K- Granted patents
- 108
- Published applications
- 74
- Assignees
- 69
- Inventors
- 298
- Latest grant
- 21 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 5 | 0 |
| 1992 | 3 | 0 |
| 1993 | 3 | 0 |
| 1994 | 3 | 0 |
| 1995 | 8 | 0 |
| 1996 | 3 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 5 | 0 |
| 2000 | 4 | 0 |
| 2001 | 1 | 4 |
| 2002 | 6 | 4 |
| 2003 | 5 | 5 |
| 2004 | 2 | 4 |
| 2005 | 3 | 2 |
| 2006 | 1 | 0 |
| 2007 | 1 | 1 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 2 | 0 |
| 2011 | 3 | 0 |
| 2012 | 0 | 1 |
| 2013 | 0 | 1 |
| 2014 | 0 | 3 |
| 2015 | 2 | 1 |
| 2016 | 1 | 4 |
| 2017 | 5 | 5 |
| 2018 | 1 | 5 |
| 2019 | 2 | 7 |
| 2020 | 7 | 5 |
| 2021 | 3 | 4 |
| 2022 | 4 | 5 |
| 2023 | 5 | 2 |
| 2024 | 4 | 4 |
| 2025 | 5 | 7 |
| 2026 | 2 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Sn-based alloy solder pastes21 Apr 2026US 12,606,887 B2Heraeus Electronics GmbH & Co. KG
- Indium solder paste compositions3 Mar 2026US 12,564,907 B2Ormet Circuits, Inc.
- Flux and solder paste23 Dec 2025US 12,502,735 B2Senju Metal Industry Co., Ltd.
- Flux, solder paste, and method for producing bonded body17 Jun 2025US 12,330,244 B2Senju Metal Industry Co., Ltd.
- Flux and method for producing assembly20 May 2025US 12,304,008 B2Senju Metal Industry Co., Ltd.
- Conductive paste for bonding28 Aug 2025US 2025/0269473 A1Daicel Corporation
- Flux and solder paste21 Aug 2025US 2025/0262692 A1Senju Metal Industry Co., Ltd.
- Flux, solder paste, and method for producing bonded body29 May 2025US 2025/0170679 A1Senju Metal Industry Co., Ltd.
- Solder Paste for Connection Pin20 Feb 2025US 2025/0058413 A1Duksan Hi-Metal Co., Ltd.
- Flux and solder paste comprising said flux23 Jan 2025US 2025/0025968 A1Heraeus Electronics GmbH & Co. KG
Most cited
By later US patents
- Process for surface treatment of copper and copper alloy43US 5,173,130 AShikoku Chemicals Corporation · 1992
- Water washable soldering paste38US 5,064,480 AQuantum Materials, Inc. · 1991
- Soldering flux38US 5,417,771 ANihon Superior Co., Ltd. · 1995
- Cleaning agents comprising beta-diketone and beta-ketoimine ligands and a process for using the same36US 5,094,701 AAir Products and Chemicals, Inc. · 1992
- Solder flux compatible with flip-chip underfill material36US 6,367,150 B1Northrop Grumman Corporation · 2002