Process for surface treatment of copper and copper alloy
AssigneeShikoku Chemicals Corporation
InventorsMasashi Kinoshita, Takayuki Murai, Takashi Yoshioka
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Abstract
Disclosed is a process for the surface treatment of copper or a copper alloy, which comprises immersing the surface of copper or a copper alloy in an aqueous solution containing a benzimidazole compound having an alkyl group of at least 3 carbon atoms at the 2-position and an organic acid.
Claims15
A process for forming a chemically formed layer on the surface of copper or a copper alloy to be soldered, wherein the layer protects the copper or the copper alloy from oxidation upon heating, which comprises immersing the surface of the copper or the copper alloy in an aqueous solution containing a benzimidazole compound and an organic acid, wherein the benzimidazole compound has an alkyl group of at least 3 carbon atoms at the 2-position and has the formula ##STR4## wherein R.sub.1 represents an alkyl group having at least 3 carbon atoms, and R.sub.2, R.sub.3 and R.sub.4 represent a lower alkyl group, a halogen atom, a nitro group or a hydrogen atom.
A process for forming a chemically formed layer on the surface of copper or a copper alloy to be soldered wherein the layer protects the copper or copper alloy from oxidation upon heating, which comprises immersing the surface of copper or a copper alloy in an aqueous solution containing a benzimidazole compound and an organic acid, wherein the benzimidazole compound has an alkyl group of at least 3 carbon atoms at the 2-position and has the formula ##STR8## wherein R.sub.1 represents an alkyl group having at least 3 carbon atoms, and R.sub.2, R.sub.3 and R.sub.4 represent a lower alkyl group, a halogen atom, a nitro group or a hydrogen atom,
- and then, immersing the metal surface with an aqueous solution containing a zinc compound.
A process for forming a chemically formed layer on the surface of copper or a copper alloy to be soldered wherein the layer protects the copper or copper alloy from oxidation upon heating, which comprises immersing the surface of copper or copper alloy in an aqueous solution containing a benzimidazole compound, an organic acid and a zinc compound wherein the benzimidazole compound has an alkyl group of at least 3 carbon atoms at the 2-position and has the formula ##STR9## wherein R.sub.1 represents an alkyl group having at least 3 carbon atoms, and R.sub.2, R.sub.3 and R.sub.4 represent a lower alkyl group, a halogen atom, a nitro group or a hydrogen atom.
A process for forming a chemically formed layer on the surface of copper or copper alloy to be soldered for protecting the copper or the copper alloy from oxidation upon heating which comprises immersing the copper or copper alloy surface in an aqueous solution containing a benzimidazole compound and an organic acid, wherein the benzimidazole compound has an alkyl group of at least 3 carbon atoms at the 2-position and has the formula ##STR10## wherein R.sub.1 represents an alkyl group having at least 3 carbon atoms, and R.sub.2, R.sub.3 and R.sub.4 represent a lower alkyl group, a halogen atom, a nitro group or a hydrogen atom,
- and then, immersing the metal surface with an aqueous solution containing a copper compound.
A process for forming a chemically formed layer on the surface of copper or copper alloy to be soldered wherein the layer protects the copper or copper alloy from oxidation upon heating, which comprises immersing the copper or copper alloy surface in an aqueous solution containing a benzimidazole compound and an organic acid and a copper compound, wherein the benzimidazole compound has an alkyl group of at least 3 carbon atoms at the 2-position and has the formula ##STR11## wherein R.sub.1 represents an alkyl group having at least 3 carbon atoms, and R.sub.2, R.sub.3 and R.sub.4 represent a lower alkyl group, a halogen atom, a nitro group or a hydrogen atom.
Dependencies are inferred from the claim text.