Flux, solder paste, and method for producing bonded body

A flux comprising:

• at least one selected from the group consisting of isobornyl cyclohexanol and trimethylolpropane;
• a compound of general formula (1), the compound having a boiling point of 250° C. or more and a relative permittivity of 6.0 or more;
• and a thixotropic agent, wherein
• resin components are not comprised,
• the thixotropic agent comprises a polyamide which is condensate of an aliphatic carboxylic acid, a hydroxy group-containing aliphatic carboxylic acid and an amine,
• an amount of the at least one selected from the group consisting of isobornyl cyclohexanol and trimethylolpropane relative to a total mass, 100% by mass, of the flux is 30% by mass or more, and
• an amount of the polyamide relative to the total mass of the flux, 100% by mass, exceeds 2% by mass,
• in the formula, R1 is a hydrocarbon group having two to four carbon atoms, R2 is a hydrocarbon group having four to ten carbon atoms, and m is 1 to 3.