Flux and solder paste

Abstract

A flux containing rosin, a solvent, a thixotropic agent, a thiol compound, and an activator, in which the thiol compound includes a compound (Tp) having a benzenethiol skeleton in which one or more hydrogen atoms on a benzene ring are substituted with a mercapto group (—SH), is provided in the present invention. As the compound (Tp), at least one thiol compound selected from the group consisting of 2-aminobenzenethiol, 4-aminobenzenethiol, 3-aminobenzenethiol, and benzenethiol is preferable. According to such flux, a change in viscosity of the solder paste with time can be further suppressed.

Dependencies are inferred from the claim text.