Soldering flux
AssigneesTakeda Chemical Industries, Ltd., Nihon Superior Co., Ltd.
InventorsKazuhiro Arita, Tetsuro Nishimura
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Abstract
A soldering flux comprising a bis (2-oxazoline) compound, a dithiol compound, an organic carboxylic acid compound and an activator which does not require post-soldering cleaning and, yet, does not cause corrosion of the base metal or deterioration of electrical characteristics and helps to clear the statutory regulations on the use of chlorofluorohydrocarbons. A soldering flux comprising, in addition to the above components, an organic solvent, a thermoplastic resin or/and an epoxy group-containing compound.
Claims19
A soldering flux comprising a bis(2-oxazoline) compound, a dithiol compound and an organic carboxylic acid compound.
Dependencies are inferred from the claim text.