Back to results
US 2025/0058413 A1Published application
Solder Paste for Connection Pin
AssigneeDuksan Hi-Metal Co., Ltd.
InventorsOh Heebong, Park Soon-Ho, Eun Dong Jin, Pyun Min Wook, Jang Hyun-Ji, Kim Kyung Tae, Kim Jin-Gyu, Kim Min-Woo
Life of this patent
Estimating the term…
Abstract
In one aspect of the present invention, a solder paste for connection pins is provided, comprising: solder powder that includes tin, has a mean diameter of 3˜5 μm, and wherein the proportion of powder particles with a diameter of 8 μm or more is less than 1 wt %; and a flux that enhances the wettability of the aforementioned solder powder.
Claims15
A solder paste for connection pins, comprising:
- solder powder having a mean diameter of 3˜5 μm, wherein the proportion of powder particles with a diameter of 8 μm or more is less than 1 wt %;
- and
- a flux for enhancing the wettability of the solder powder.
Dependencies are inferred from the claim text.