B23K 2035/008
At least one of the workpieces being of silicium
Official title: {at least one of the workpieces being of silicium}
B23K2035/008 (At least one of the workpieces being of silicium) appears on 40 US grants and 4 published applications in this corpus.
Search patents in B23K- Granted patents
- 40
- Published applications
- 4
- Assignees
- 28
- Inventors
- 84
- Latest grant
- 3 Sep 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 7 | 0 |
| 1977 | 2 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 4 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 1 |
| 2006 | 1 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 1 |
| 2015 | 0 | 1 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 1 | 0 |
| 2019 | 1 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 0 |
| 2024 | 1 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Layered bonding material, semiconductor package, and power module3 Sep 2024US 12,080,671 B2Senju Metal Industry Co., Ltd.
- Transfer substrate for forming metal wiring and method for forming metal wiring with the transfer substrate9 Apr 2019US 10,256,113 B2Tanaka Kikinzoku Kogyo K.K.
- 3D TSV assembly method for mass reflow21 Aug 2018US 10,052,705 B2Universal Instruments Corporation
- Braze-based protective coating for silicon nitride3 Oct 2006US 7,115,319 B2Honeywell International Inc.
- Process for the production of a holding device for semiconductor disks and holding device produced by this process21 Aug 2001US 6,276,592 B1Sico Jena GmbH Quarzschmelze
- Layered bonding material, semiconductor package, and power module27 Jun 2024US 2024/0213206 A1Senju Metal Industry Co., Ltd.
- 3d tsv assembly method for mass reflow18 Jun 2015US 2015/0165537 A1Universal Instruments Corporation
- Transfer substrate for forming metal wiring line and method for forming metal wiring line by means of said transfer substrate18 Sep 2014US 2014/0262003 A1Tanaka Kikinzoku Kogyo K.K.
- Braze-based protective coating for silicon nitride14 Apr 2005US 2005/0079343 A1Honeywell International Inc.
Most cited
By later US patents
- Semiconductor electrical heater and method for making same354US 5,498,850 APhilip Morris Incorporated · 1996
- Semiconductor electrical heater and method for making same189US 5,659,656 APhilip Morris Incorporated · 1997
- Flip-Chip interconnections using lead-free solders99US 6,224,690 B1International Business Machines Corporation · 2001
- Low temperature reactive bonding79US 5,381,944 AThe Regents of the University of California · 1995
- Method for attaching disc- or plate-shaped targets to cooling plates for sputtering systems60US 4,341,816 ASiemens Aktiengesellschaft · 1982