3D TSV assembly method for mass reflow

A method comprising:

• a) picking up a plate with a nozzle at an assembly machine, the plate including at least one opening to allow air to flow therethrough;
• b) picking up a die with the nozzle such that the plate is located between the nozzle and the die to create a first plate and die combination;
• c) placing the first plate and die combination onto one of a device, substrate or another die such that the plate is located on top of the die;
• d) populating a plurality of plate and die combinations, including the first plate and die combination, on the one of the device, substrate or another die by repeating steps a)-c) at least once;
• e) transferring, after the populating, the plurality of plate and die combinations and the one of the device, substrate or another die and the die from the assembly machine to a heat chamber;
• f) heating the one of the device, substrate or another die and the die and the plurality of plate and die combinations in the heat chamber to permanently attach the dies of the plurality of plate and die combinations to the one of the device, substrate or another die;
• g) transferring, after the heating, the one of the device, substrate or another die and the plurality of plate and die combinations to a plate removal machine;
• and
• h) removing the plates of the plurality of plate and die combinations from the dies of the plurality of plate and die combinations by the plate removal machine.