B23K 35/001
Interlayers, transition pieces for metallurgical bonding of workpieces
Official title: {Interlayers, transition pieces for metallurgical bonding of workpieces}
B23K35/001 (Interlayers, transition pieces for metallurgical bonding of workpieces) appears on 875 US grants and 555 published applications in this corpus.
Search patents in B23K- Granted patents
- 875
- Published applications
- 555
- Assignees
- 521
- Inventors
- 2,025
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 28 | 0 |
| 1977 | 23 | 0 |
| 1978 | 11 | 0 |
| 1979 | 6 | 0 |
| 1980 | 12 | 0 |
| 1981 | 11 | 0 |
| 1982 | 11 | 0 |
| 1983 | 10 | 0 |
| 1984 | 13 | 0 |
| 1985 | 14 | 0 |
| 1986 | 23 | 0 |
| 1987 | 27 | 0 |
| 1988 | 22 | 0 |
| 1989 | 27 | 0 |
| 1990 | 20 | 0 |
| 1991 | 28 | 0 |
| 1992 | 16 | 0 |
| 1993 | 14 | 0 |
| 1994 | 26 | 0 |
| 1995 | 15 | 0 |
| 1996 | 14 | 0 |
| 1997 | 16 | 0 |
| 1998 | 17 | 0 |
| 1999 | 21 | 0 |
| 2000 | 21 | 0 |
| 2001 | 24 | 7 |
| 2002 | 24 | 31 |
| 2003 | 28 | 36 |
| 2004 | 29 | 29 |
| 2005 | 21 | 29 |
| 2006 | 17 | 21 |
| 2007 | 11 | 17 |
| 2008 | 11 | 12 |
| 2009 | 8 | 14 |
| 2010 | 13 | 17 |
| 2011 | 9 | 29 |
| 2012 | 14 | 27 |
| 2013 | 19 | 40 |
| 2014 | 20 | 38 |
| 2015 | 17 | 34 |
| 2016 | 19 | 23 |
| 2017 | 24 | 21 |
| 2018 | 19 | 23 |
| 2019 | 22 | 17 |
| 2020 | 17 | 18 |
| 2021 | 13 | 11 |
| 2022 | 11 | 15 |
| 2023 | 8 | 14 |
| 2024 | 12 | 19 |
| 2025 | 14 | 6 |
| 2026 | 5 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- B23K 35/004At least one of the workpieces being of a metal of the293
- B23K 35/007At least one of the workpieces being of copper or another noble191
- B23K 35/002At least one of the workpieces being of light metal177
- B23K 35/005At least one of the workpieces being of a refractory metal129
- B23K 2035/008At least one of the workpieces being of siliciumIndexing code40
Recent patents
- TIG welded joint6 Oct 2026US 12,752,379 B2Jfe Steel Corporation
- Bonded substrate14 Jul 2026US 12,679,778 B2NGK Insulators, Ltd.
- Copper/ceramic bonded body and insulating circuit substrate5 May 2026US 12,622,269 B2Mitsubishi Materials Corporation
- Multi-layer ceramic plate device24 Feb 2026US 12,558,734 B2Watlow Electric Manufacturing Company
- Transient liquid phase bonding of golf club components6 Jan 2026US 12,515,110 B1Topgolf Callaway Brands Corp.
- High recycle content aluminum alloys, aluminum alloy products, and methods of producing a brazed product13 Aug 2026US 2026/0234758 A1Novelis Koblenz GmbH
- Regulation layer for dissimilar metal friction welding interface and aluminum-steel friction welding method16 Jul 2026US 2026/0200016 A1Nanchang Hangkong University
- Stainless steel and copper joined body, method of producing same, and method of joining stainless steel and copper4 Jun 2026US 2026/0151861 A1Jfe Steel Corporation
- Nickel based braze alloy, a component and a method14 May 2026US 2026/0131406 A1Siemens Energy Global GmbH & Co. KG
- Bonding element for diffusion bonding, comprising a heating element and a bonding structure with an outer metal surface9 Apr 2026US 2026/0097453 A1Tokamak Energy Ltd
Most cited
By later US patents
- Semiconductor electrical heater and method for making same354US 5,498,850 APhilip Morris Incorporated · 1996
- Strap connector214US 4,719,671 ACanon Kabushiki Kaisha · 1988
- Semiconductor electrical heater and method for making same189US 5,659,656 APhilip Morris Incorporated · 1997
- Method of securing metallic members together188US 4,727,633 ATektronix, Inc. · 1988
- Joint, a laminate, and a method of preparing a nickel-titanium alloy member surface for bonding to another layer of metal174US 5,242,759 ACook Incorporated · 1993