B23K 35/007
At least one of the workpieces being of copper or another noble
Official title: {at least one of the workpieces being of copper or another noble metal}
B23K35/007 (At least one of the workpieces being of copper or another noble) appears on 191 US grants and 146 published applications in this corpus.
Search patents in B23K- Granted patents
- 191
- Published applications
- 146
- Assignees
- 134
- Inventors
- 516
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 3 | 0 |
| 1982 | 2 | 0 |
| 1983 | 2 | 0 |
| 1984 | 2 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 3 | 0 |
| 1990 | 3 | 0 |
| 1991 | 3 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 3 | 0 |
| 1995 | 5 | 0 |
| 1996 | 7 | 0 |
| 1997 | 6 | 0 |
| 1998 | 8 | 0 |
| 1999 | 8 | 0 |
| 2000 | 7 | 0 |
| 2001 | 8 | 3 |
| 2002 | 7 | 5 |
| 2003 | 9 | 15 |
| 2004 | 7 | 7 |
| 2005 | 7 | 6 |
| 2006 | 5 | 7 |
| 2007 | 2 | 5 |
| 2008 | 2 | 3 |
| 2009 | 3 | 5 |
| 2010 | 2 | 3 |
| 2011 | 2 | 9 |
| 2012 | 3 | 11 |
| 2013 | 8 | 10 |
| 2014 | 2 | 10 |
| 2015 | 9 | 11 |
| 2016 | 6 | 5 |
| 2017 | 10 | 4 |
| 2018 | 3 | 2 |
| 2019 | 5 | 2 |
| 2020 | 2 | 4 |
| 2021 | 2 | 3 |
| 2022 | 2 | 4 |
| 2023 | 2 | 5 |
| 2024 | 6 | 4 |
| 2025 | 0 | 1 |
| 2026 | 3 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Bonded substrate14 Jul 2026US 12,679,778 B2NGK Insulators, Ltd.
- Copper/ceramic bonded body and insulating circuit substrate5 May 2026US 12,622,269 B2Mitsubishi Materials Corporation
- Transient liquid phase bonding of golf club components6 Jan 2026US 12,515,110 B1Topgolf Callaway Brands Corp.
- Ceramic-copper composite, ceramic circuit board, power module, and method of producing ceramic-copper composite8 Oct 2024US 12,109,640 B2Denka Company Limited
- Copper-ceramic joint body, brazing member and method of manufacturing copper-ceramic joint body17 Sep 2024US 12,090,564 B2Proterial, Ltd.
- Tin-based solder paste, soldering method and electronic component using same19 Mar 2026US 2026/0081363 A1Cyntec Co., Ltd.
- Alloy and methods for using alloy for transient liquid phase sintering5 Mar 2026US 2026/0068107 A1Dana Canada Corporation
- Joint and method of joining23 Oct 2025US 2025/0326044 A1Tokamak Energy Ltd
- Copper/ceramic bonded body and insulating circuit substrate31 Oct 2024US 2024/0363481 A1Mitsubishi Materials Corporation
- Composite material11 Jul 2024US 2024/0227353 A1A. L. M. T. Corp.
Most cited
By later US patents
- Semiconductor electrical heater and method for making same354US 5,498,850 APhilip Morris Incorporated · 1996
- Semiconductor electrical heater and method for making same189US 5,659,656 APhilip Morris Incorporated · 1997
- Ceramic to noble metal braze and method of manufacture84US 6,989,200 B2Alfred E. Mann Foundation for Scientific Research · 2006
- Method for bonding using laser induced heat and pressure79US 4,684,781 APhysical Sciences, Inc. · 1987
- Tin-bismuth solder connection having improved high temperature properties, and process for forming same70US 5,320,272 AMotorola, Inc. · 1994