Ceramic-copper composite, ceramic circuit board, power module, and method of producing ceramic-copper composite

A ceramic-copper composite having a flat plate shape, comprising:

• a ceramic layer;
• a copper layer;
• and a brazing material layer present between the ceramic layer and the copper layer, wherein the following Expression (1) is satisfied in a cut surface of the copper layer obtained when the ceramic-copper composite is cut at a plane perpendicular to a main surface of the ceramic-copper composite, where S(102)% is an area ratio occupied by copper crystals having a crystal orientation of which an inclination from a crystal orientation of (102) plane is within 10°, S(101)% is an area ratio occupied by copper crystals having a crystal orientation of which an inclination from a crystal orientation of (101) plane is within 10°, S(111)% is an area ratio occupied by copper crystals having a crystal orientation of which an inclination from a crystal orientation of (111) plane is within 10°, and S(112)% is an area ratio occupied by copper crystals having a crystal orientation of which an inclination from a crystal orientation of (112) plane is within 10°, Expression (1) S(102)+S(101)>S(111)+S(112), wherein the ceramic layer and the copper layer are bonded by the brazing material layer, wherein the copper layer is formed of a rolled copper plate having a first surface facing the ceramic layer and a second surface opposite to the first surface, wherein the brazing material layer includes Ag, Cu and Ti, and either Sn or In, or both Sn and In, and wherein the brazing material layer includes 1.5 parts by mass or more and 5.0 parts by mass or less of Ti, and wherein in the second surface, an average crystal grain size of the copper crystals measured by an intercept method is 250 μm or less.