Transfer substrate for forming metal wiring line and method for forming metal wiring line by means of said transfer substrate

A transfer substrate for transferring a metal wiring material to a transfer target, the transfer substrate comprising:

• a substrate;
• at least one metal wiring material formed on the substrate;
• at least one coating layer formed on a surface of the metal wiring material;
• and
• an underlying metal film formed between the substrate and the metal wiring material, wherein the metal wiring material comprises a composition formed by sintering one or more kinds of metal powder having a purity of 99.9 wt % or more and an average particle size of 0.01 μm to 1.0 μm selected from gold powder, silver powder, platinum powder, palladium powder and copper powder;
• the coating layer comprises one or more of any metal of gold, silver, platinum, palladium, ruthenium, rhodium, iridium, chromium, titanium, tungsten, tantalum, nickel, copper and zirconium or an alloy thereof;
• the coating layer comprises a metal or an alloy having a different composition from the composition of the metal wiring material and has a total thickness of 1 μm or less;
• and the underlying metal film comprises one or more of any metal of gold, silver, platinum, palladium, ruthenium, rhodium, iridium, chromium, titanium, tungsten, tantalum, nickel, copper and zirconium or an alloy thereof.