Method for attaching disc- or plate-shaped targets to cooling plates for sputtering systems
AssigneeSiemens Aktiengesellschaft
InventorsRichard Lauterbach, Hartmut Keller
Life of this patent
Estimating the term…
Abstract
Disc- or plate-shaped targets for sputtering systems are attached to associated cooling plates by plasma-spraying a surface of such target with a compatible adhesive layer, for example composed of Ni; Ni/Cr mixtures; 80/20 Ni/Al mixtures; Ni/Al/Mo mixtures; Al/bronze mixtures; Mo; W; Al/Si mixtures, Zn, Cu, Cu/glass mixtures, etc., and then coating such adhesive layer with a solderable layer, for example composed of Cu, Cu/glass mixture or Ag, etc., and soldering such solderable layer onto the surface of a cooling plate. Preferably, the adhesive layer and the solderable layer are applied via plasma spraying.
Claims12
A method of attaching a body composed of a select target material onto a cooling plate for sputtering systems, comprising:
- applying a layer of an adhesive material compatible with said select target material onto a surface of said body;
- plasma spraying said adhesive layer with a relatively thick solderable layer having a thickness in the range of about 30 to 100 .mu.m and being composed of a material selected from the group consisting of copper, copper/glass mixtures and silver, and
- soft-soldering such coated surface of the body with a surface of a cooling plate.
Dependencies are inferred from the claim text.