A21D 13/36
Filled wafers
A21D13/36 (Filled wafers) appears on 28 US grants and 49 published applications in this corpus.
Search patents in A21D- Granted patents
- 28
- Published applications
- 49
- Assignees
- 32
- Inventors
- 128
- Latest grant
- 21 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 3 | 0 |
| 1999 | 0 | 0 |
| 2000 | 3 | 0 |
| 2001 | 1 | 1 |
| 2002 | 0 | 2 |
| 2003 | 0 | 2 |
| 2004 | 3 | 5 |
| 2005 | 0 | 1 |
| 2006 | 0 | 0 |
| 2007 | 0 | 1 |
| 2008 | 1 | 1 |
| 2009 | 0 | 0 |
| 2010 | 0 | 3 |
| 2011 | 0 | 2 |
| 2012 | 0 | 1 |
| 2013 | 0 | 1 |
| 2014 | 0 | 2 |
| 2015 | 1 | 9 |
| 2016 | 1 | 2 |
| 2017 | 0 | 1 |
| 2018 | 1 | 3 |
| 2019 | 3 | 2 |
| 2020 | 1 | 3 |
| 2021 | 0 | 2 |
| 2022 | 2 | 3 |
| 2023 | 1 | 0 |
| 2024 | 1 | 0 |
| 2025 | 2 | 1 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Bakery product ready for baking21 Apr 2026US 12,604,907 B2Soremartec S.A.
- Stuffed waffle utensil9 Dec 2025US 12,490,859 B2National Presto Industries, Inc.
- Communion wafer infused with desiccated liquid and method for making same13 May 2025US 12,295,399 B2
- Filling for a food product, food product with the filling, method of making the filling11 Jun 2024US 12,004,520 B2GRIESSON—DE BEUKELAER GmbH & Co. KG
- Method for obtaining ice cream cones and product thereof8 Aug 2023US 11,717,004 B2KH Alacant Innova, S.L.U.
- Method for making a plurality of wafer bodies30 Apr 2026US 2026/0114460 A1Soremartec S.A.
- Aerated fat-based confectionary material6 Feb 2025US 2025/0040565 A1
- Bakery product ready for baking26 May 2022US 2022/0159976 A1Soremartec S.A.
- Novel frozen confection shaped bakery item compositions7 Apr 2022US 2022/0104507 A1Conopco, Inc., d/b/a UNILEVER
- Communion Wafer Infused with Desiccated Liquid and Method for Making Same24 Mar 2022US 2022/0087300 A1
Most cited
By later US patents
- Process of manufacturing candy bars containing wafers and wafer bars manufactured thereby171US 4,545,997 AHershey Foods Corporation · 1985
- Discrete wafer assembled cookie and method of making same43US 5,731,020 A1998
- Wafer product and process of manufacture27US 6,027,753 AGood Humor-Breyers Ice Cream · 2000
- Confectionery product comprising vegetables solids18US 6,713,100 B1Nestec S. A. · 2004
- Food product comprising a wafer shell and a creamy filling with a caramel core and process for producing the same15US 6,103,279 ASoremartec S.A. · 2000