Metryx Limited
Bristol, GB· latest recorded location
METRYX LIMITED is named on 17 US grants and 23 published applications in this corpus. Its most frequent classification is H10P (Generic processes or apparatus for the manufacture or treatment of devices covered).
- Granted patents
- 17
- Published applications
- 23
- Inventors
- 13
- Granted in 2026 so far
- 1
- Most recent grant
- 10 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2003 | 0 | 1 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 1 | 1 |
| 2007 | 0 | 0 |
| 2008 | 1 | 1 |
| 2009 | 0 | 0 |
| 2010 | 0 | 3 |
| 2011 | 1 | 3 |
| 2012 | 2 | 0 |
| 2013 | 3 | 2 |
| 2014 | 1 | 2 |
| 2015 | 0 | 0 |
| 2016 | 4 | 2 |
| 2017 | 1 | 1 |
| 2018 | 2 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 1 |
| 2022 | 0 | 1 |
| 2023 | 0 | 0 |
| 2024 | 0 | 2 |
| 2025 | 0 | 2 |
| 2026 | 1 | 1 |
By publication year. 2026 runs to 8 Oct.
Technology areas
Share of 40 documents
- H10PGeneric processes or apparatus for the manufacture or treatment of devices covered36
- G01GWeighing26
- G01RMeasuring electric variables8
- G01NInvestigating or analysing materials by determining their chemical or physical properties5
- C30BSingle-crystal growth4
- G05BControl or regulating systems in general4
- H01JElectric discharge tubes or discharge lamps4
- B06BMethods or apparatus for generating or transmitting mechanical vibrations of infrasonic, sonic2
- G01HMeasurement of mechanical vibrations or ultrasonic, sonic or infrasonic waves2
- G01JMeasurement of intensity, velocity, spectral content, polarisation, phase or pulse characteristics of2
Recent patents
- Method and apparatus for controlling the temperature of a semiconductor wafer10 Feb 2026US 12,546,646 B2
- Measurement apparatus and method12 Jun 2018US 9,995,783 B2
- Method and device for determining information relating to the mass of a semiconductor wafer27 Feb 2018US 9,903,750 B2
- Semiconductor wafer processing methods and apparatus14 Nov 2017US 9,818,658 B2
- Measurement apparatus and method23 Aug 2016US 9,423,447 B2
- Support for a weighing device8 Jan 2026US 2026/0009671 A1
- Weighing device for a semiconductor wafer15 May 2025US 2025/0155273 A1
- Weighing device27 Mar 2025US 2025/0102349 A1
- Device for changing the temperature of a wafer17 Oct 2024US 2024/0347352 A1
- Apparatus comprising a weighing device27 Jun 2024US 2024/0210232 A1
Most cited
By later US patents
- Apparatus and method for investigating semiconductors wafer19US 7,020,577 B22006
- Apparatus and method for investigating parameters of layers deposited on semiconductor wafers16US 7,340,372 B22008
- Measuring apparatus9US 7,892,863 B22011
- Semiconductor wafer metrology apparatus and method8US 8,357,548 B22013
- Measuring apparatus7US 8,200,447 B22012