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US 2025/0102349 A1Published application
Weighing device
AssigneeMetryx Limited
InventorsGregor Robert ELLIOTT, Sam OWENS
Life of this patent
Estimating the term…
Abstract
A weighing device for performing a weight measurement on a semiconductor wafer having a specific diameter, the weighing device comprising a weighing pan for supporting the wafer during the weight measurement, wherein: the weighing pan is grounded; and the weighing pan is configured to extend over at least 25% of an area of a surface of the wafer that faces the weighing pan.
Claims19
A weighing device for performing a weight measurement on a semiconductor wafer having a specific diameter,
- the weighing device comprising a weighing pan for supporting the wafer during the weight measurement, wherein:
- the weighing pan is grounded;
- and
- the weighing pan is configured to extend over at least 25% of an area of a surface of the wafer that faces the weighing pan.
1 more element
A method comprising:
- performing a weight measurement on a semiconductor wafer using a weighing device, wherein the weighing device comprises a weighing pan that supports the wafer during the weight measurement, wherein:
- the weighing pan is grounded;
- and
- the weighing pan extends over at least 25% of an area of a surface of the wafer that faces the weighing pan.
1 more element
Dependencies are inferred from the claim text.