Method and apparatus for controlling the temperature of a semiconductor wafer
AssigneeMetryx Limited
InventorsGregor Elliott, Eric Tonnis, Paul Harrison, Mark Berry
Life of this patent
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Abstract
A semiconductor wafer mass metrology method comprising: controlling the temperature of a semiconductor wafer by: detecting information relating to the temperature of the semiconductor wafer; and controlling cooling or heating of the semiconductor wafer based on the detected information relating to the temperature of the semiconductor wafer; wherein controlling the cooling or heating of the semiconductor wafer comprises controlling a duration of the cooling or heating of the semiconductor wafer; and subsequently loading the semiconductor wafer onto a measurement area of a semiconductor wafer mass metrology apparatus.
Claims20
A semiconductor wafer mass metrology method comprising:
- controlling, via a controller, cooling or heating of a semiconductor wafer by:
- detecting information relating to an incoming temperature of the semiconductor wafer, wherein the information relating to the incoming temperature of the semiconductor wafer is detected before starting cooling or heating of the semiconductor wafer when performing cooling or heating of the semiconductor wafer via a cooling or heating part;
- comparing the detected information relating to the incoming temperature of the semiconductor wafer with a threshold value;
- based on a result of the comparison,
- categorising the semiconductor wafer into one of a plurality of categories;
- and
- controlling cooling or heating of the semiconductor wafer based on a result of the categorisation;
- wherein controlling the cooling or heating of the semiconductor wafer based on the result of the categorisation comprises setting a duration of the cooling or heating of the semiconductor wafer, or deciding not to perform the cooling or heating of the semiconductor wafer;
- and
- subsequently loading the semiconductor wafer onto a measurement area of a semiconductor wafer mass metrology apparatus.
A semiconductor wafer mass metrology apparatus comprising:
- a cooling or heating part for cooling or heating a semiconductor wafer;
- a controller configured to control cooling or heating of the semiconductor wafer by the cooling or heating part based on detected information relating to an incoming temperature of the semiconductor wafer, wherein the information relating to the incoming temperature of the semiconductor wafer is detected before starting cooling or heating of the semiconductor wafer when performing cooling or heating of the semiconductor wafer;
- and
- wherein the controller is configured to:
- compare the detected information relating to the incoming temperature of the semiconductor wafer with a threshold value;
- based on a result of the comparison, categorise the semiconductor wafer into one of a plurality of categories;
- and
- control the cooling or heating of the semiconductor wafer based on a result of the categorization;
- and
- wherein, to control the cooling or heating of the semiconductor wafer by the cooling or heating part based on the result of the categorization, the controller is configured to set a duration of the cooling or heating of the semiconductor wafer by the cooling or heating part, or decide not to perform the cooling or heating of the semiconductor wafer by the cooling or heating part;
- and
- a measurement area onto which the semiconductor wafer is subsequently loaded.
Dependencies are inferred from the claim text.