Device for changing the temperature of a wafer
AssigneeMetryx Limited
InventorsGregor Robert ELLIOTT, Robert John WILBY, Abraham MOOSAVI, Sam OWENS
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Abstract
A device for changing the temperature of a wafer, the device comprising: a surface that is configured to support the wafer and to exchange heat with the wafer, and a space that is configured to receive at least a distal part of an end effector, which is used to support the wafer from beneath, when the end effector is used to lower the wafer onto the surface, wherein the space extends from or to a side of the device; and wherein the space is configured so that the at least a distal part of the end effector can be withdrawn from the space from the side of the device.
Claims39
A device for changing the temperature of a wafer, the device comprising:
- a surface that is configured to support the wafer and to exchange heat with the wafer, and
- a space that is configured to receive at least a distal part of an end effector, which is used to support the wafer from beneath, when the end effector is used to lower the wafer onto the surface,
- wherein the space extends from or to a side of the device;
- and
- wherein the space is configured so that the at least a distal part of the end effector can be withdrawn from the space from the side of the device.
A device for changing the temperature of a wafer, the device comprising a baseplate and a top-plate that is attached to the baseplate, wherein the top-plate comprises a surface configured to support the wafer and to exchange heat with the wafer.
Dependencies are inferred from the claim text.