Semiconductor wafer processing methods and apparatus

A semiconductor wafer weighing method comprising:

• controlling the temperature of a semiconductor wafer to be within a predetermined measurement temperature range by causing a change in the temperature of the semiconductor wafer using a temperature changing unit, wherein the temperature changing unit comprises a thermal transfer plate that is provided on an outer surface of a weighing chamber of a semiconductor wafer weighing apparatus and that is thermally coupled to, or integral to, the outer surface of the weighing chamber of the semiconductor wafer weighing apparatus, so that the thermal transfer plate is substantially in thermal equilibrium with the weighing chamber of the semiconductor wafer weighing apparatus and has substantially the same temperature as the weighing chamber of the semiconductor wafer weighing apparatus, wherein the semiconductor wafer is positioned on the thermal transfer plate to cause the change in the temperature of the semiconductor wafer;
• and
• transporting the semiconductor wafer from the temperature changing unit to a weighing balance of the semiconductor wafer weighing apparatus located within the weighing chamber of the semiconductor wafer weighing apparatus;
• and
• controlling the temperature of the semiconductor wafer to be substantially the same as the temperature of the semiconductor wafer as it leaves the temperature changing unit during the transporting step.

A semiconductor wafer weighing apparatus comprising:

• a weighing chamber containing a weighing balance;
• a first temperature changing unit for causing a first change in the temperature of a semiconductor wafer;
• and
• a second temperature changing unit for subsequently causing a second change in the temperature of the semiconductor wafer, wherein the second temperature changing unit comprises a thermal transfer plate that is provided on an outer surface of the weighing chamber and that is thermally coupled to, or integral to, the outer surface of the weighing chamber, so that the thermal transfer plate is substantially in thermal equilibrium with the weighing chamber and has substantially the same temperature as the weighing chamber.

A semiconductor wafer weighing apparatus comprising:

• a weighing chamber containing a weighing balance;
• a temperature changing unit for causing a change in the temperature of a semiconductor wafer, wherein the temperature changing unit comprises a thermal transfer plate that is provided on an outer surface of the weighing chamber and that is thermally coupled to, or integral to, the outer surface of the weighing chamber, so that the thermal transfer plate is substantially in thermal equilibrium with the weighing chamber and has substantially the same temperature as the weighing chamber;
• a semiconductor wafer transporter for transporting the semiconductor wafer from the temperature changing unit to the weighing balance;
• and
• temperature control means for controlling the temperature of the semiconductor wafer to be substantially the same as the temperature of the semiconductor wafer as it leaves the temperature changing unit during the transporting.