Y10T 428/1291
Next to co-, cu-, or ni-base component
Official title: Next to Co-, Cu-, or Ni-base component
Y10T428/1291 (Next to co-, cu-, or ni-base component) appears on 641 US grants and 364 published applications in this corpus.
Search patents in Y10T- Granted patents
- 641
- Published applications
- 364
- Assignees
- 349
- Inventors
- 1,317
- Latest grant
- 28 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 16 | 0 |
| 1977 | 8 | 0 |
| 1978 | 7 | 0 |
| 1979 | 5 | 0 |
| 1980 | 5 | 0 |
| 1981 | 9 | 0 |
| 1982 | 6 | 0 |
| 1983 | 8 | 0 |
| 1984 | 13 | 0 |
| 1985 | 19 | 0 |
| 1986 | 7 | 0 |
| 1987 | 6 | 0 |
| 1988 | 5 | 0 |
| 1989 | 13 | 0 |
| 1990 | 6 | 0 |
| 1991 | 11 | 0 |
| 1992 | 7 | 0 |
| 1993 | 4 | 0 |
| 1994 | 11 | 0 |
| 1995 | 15 | 0 |
| 1996 | 23 | 0 |
| 1997 | 30 | 0 |
| 1998 | 17 | 0 |
| 1999 | 23 | 0 |
| 2000 | 19 | 0 |
| 2001 | 22 | 8 |
| 2002 | 27 | 24 |
| 2003 | 26 | 35 |
| 2004 | 17 | 23 |
| 2005 | 29 | 20 |
| 2006 | 12 | 14 |
| 2007 | 13 | 19 |
| 2008 | 10 | 12 |
| 2009 | 11 | 16 |
| 2010 | 13 | 14 |
| 2011 | 13 | 20 |
| 2012 | 11 | 20 |
| 2013 | 26 | 15 |
| 2014 | 11 | 14 |
| 2015 | 13 | 18 |
| 2016 | 12 | 11 |
| 2017 | 10 | 9 |
| 2018 | 12 | 10 |
| 2019 | 8 | 8 |
| 2020 | 8 | 11 |
| 2021 | 6 | 11 |
| 2022 | 9 | 10 |
| 2023 | 9 | 12 |
| 2024 | 9 | 5 |
| 2025 | 6 | 4 |
| 2026 | 5 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Home appliance including hairline and manufacturing method thereof28 Jul 2026US 12,692,615 B2Samsung Electronics Co., Ltd.
- Low-transmission-loss copper-based composite material and preparation method thereof, PCB, and electronic component30 Jun 2026US 12,668,890 B2Songshan Lake Materials Laboratory
- Anti-cavitation damping composite metal structure for flow passage component2 Jun 2026US 12,644,189 B2Hohai University
- Flexible copper-clad laminate and printed circuit made therefrom3 Mar 2026US 12,568,577 B2Dupont Electronics, Inc.
- Structure containing Sn layer or Sn alloy layer6 Jan 2026US 12,519,071 B2Ishihara Chemical Co., Ltd.
- Surface-treated copper foil16 Apr 2026US 2026/0107381 A1Dupont Electronics, Inc.
- Low-transmission-loss copper-based composite material and preparation method thereof, pcb, and electronic component20 Nov 2025US 2025/0354294 A1Songshan Lake Materials Laboratory
- Copper-coated steel wire30 Oct 2025US 2025/0336564 A1Sumitomo Electric Industries, Ltd.
- Method of manufacturing composite metal foil17 Jul 2025US 2025/0230569 A1Industrial Technology Research Institute
- Active metal brazing substrate material and method for producing the same9 Jan 2025US 2025/0010390 A1Tong Hsing Electronic Industries, Ltd.
Most cited
By later US patents
- Electronic device using magnetic components385US 5,695,864 AInternational Business Machines Corporation · 1997
- Magnetic material wire220US 4,525,432 AFujikura Ltd. · 1985
- Magnetoresistance effect element145US 5,549,978 AKabushiki Kaisha Toshiba · 1996
- Multilayer pulsed-current electrodeposition process87US 4,869,971 A1989
- Method for preparing a conductive pad for electrical connection and conductive pad formed81US 6,335,104 B12002