Y10T 428/12903
Cu-base component
Y10T428/12903 (Cu-base component) appears on 1,331 US grants and 783 published applications in this corpus.
Search patents in Y10T- Granted patents
- 1,331
- Published applications
- 783
- Assignees
- 680
- Inventors
- 2,688
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 36 | 0 |
| 1977 | 19 | 0 |
| 1978 | 16 | 0 |
| 1979 | 11 | 0 |
| 1980 | 15 | 0 |
| 1981 | 18 | 0 |
| 1982 | 9 | 0 |
| 1983 | 15 | 0 |
| 1984 | 26 | 0 |
| 1985 | 28 | 0 |
| 1986 | 18 | 0 |
| 1987 | 20 | 0 |
| 1988 | 20 | 0 |
| 1989 | 25 | 0 |
| 1990 | 18 | 0 |
| 1991 | 26 | 0 |
| 1992 | 23 | 0 |
| 1993 | 17 | 0 |
| 1994 | 23 | 0 |
| 1995 | 22 | 0 |
| 1996 | 31 | 0 |
| 1997 | 38 | 0 |
| 1998 | 30 | 0 |
| 1999 | 34 | 0 |
| 2000 | 51 | 0 |
| 2001 | 56 | 25 |
| 2002 | 65 | 59 |
| 2003 | 60 | 71 |
| 2004 | 50 | 60 |
| 2005 | 44 | 46 |
| 2006 | 40 | 43 |
| 2007 | 31 | 47 |
| 2008 | 23 | 32 |
| 2009 | 20 | 37 |
| 2010 | 31 | 38 |
| 2011 | 30 | 37 |
| 2012 | 30 | 48 |
| 2013 | 42 | 35 |
| 2014 | 31 | 22 |
| 2015 | 27 | 31 |
| 2016 | 21 | 18 |
| 2017 | 15 | 17 |
| 2018 | 20 | 13 |
| 2019 | 15 | 16 |
| 2020 | 18 | 19 |
| 2021 | 11 | 19 |
| 2022 | 18 | 17 |
| 2023 | 14 | 17 |
| 2024 | 13 | 9 |
| 2025 | 10 | 6 |
| 2026 | 7 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Inlaid timepiece component and method for manufacturing the same18 Aug 2026US 12,710,728 B2Comadur SA
- Home appliance including hairline and manufacturing method thereof28 Jul 2026US 12,692,615 B2Samsung Electronics Co., Ltd.
- Low-transmission-loss copper-based composite material and preparation method thereof, PCB, and electronic component30 Jun 2026US 12,668,890 B2Songshan Lake Materials Laboratory
- Surface-modified aluminum alloy substrate structure23 Jun 2026US 12,662,739 B2Amulaire Thermal Technology, Inc.
- Anti-cavitation damping composite metal structure for flow passage component2 Jun 2026US 12,644,189 B2Hohai University
- Surface-treated copper foil16 Apr 2026US 2026/0107381 A1Dupont Electronics, Inc.
- Low-transmission-loss copper-based composite material and preparation method thereof, pcb, and electronic component20 Nov 2025US 2025/0354294 A1Songshan Lake Materials Laboratory
- Copper-coated steel wire30 Oct 2025US 2025/0336564 A1Sumitomo Electric Industries, Ltd.
- Method of manufacturing composite metal foil17 Jul 2025US 2025/0230569 A1Industrial Technology Research Institute
- Rolled material10 Jul 2025US 2025/0223670 A1Proterial, Ltd.
Most cited
By later US patents
- Process for depositing a tungsten-based and/or molybdenum-based layer on a rigid substrate, and substrate thus coated562US 6,383,566 B1Saint-Gobain Vitrage · 2002
- Electronic device using magnetic components385US 5,695,864 AInternational Business Machines Corporation · 1997
- Magnetic material wire220US 4,525,432 AFujikura Ltd. · 1985
- Wire and cable216US 4,985,313 ARaychem Corporation · 1991
- Wire and cable215US 5,209,987 ARaychem Corporation · 1993