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US 12,662,739 B2Granted
Surface-modified aluminum alloy substrate structure
AssigneeAmulaire Thermal Technology, Inc.
InventorsYi-Hsin Huang, Ching-Ming Yang, Kuo-Wei Lee, Tze-Yang Yeh
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Abstract
A surface-modified aluminum alloy substrate structure includes a 6000-Series aluminum alloy substrate, a diffusion buffer layer, and a meltable metallic layer. The diffusion buffer layer is formed on the 6000-Series aluminum alloy substrate for buffering magnesium in the 6000-Series aluminum alloy substrate from diffusing to a meltable metallic layer. The meltable metallic layer is formed on the diffusion buffer layer for being melted in a subsequent process.
Claims7
A surface-modified aluminum alloy substrate structure, comprising:
- a 6000-Series aluminum alloy substrate;
- a diffusion buffer layer formed on the 6000-Series aluminum alloy substrate for buffering magnesium in the 6000-Series aluminum alloy substrate from diffusing to a meltable metallic layer;
- a meltable metallic layer formed on the diffusion buffer layer for being melted in a subsequent process;
- and
- a brazing promotion layer formed on the meltable metallic layer for enhancing a eutectic reaction;
- wherein the brazing promotion layer is made of an alloy that includes copper, nickel, and zinc.
3 more elements
Dependencies are inferred from the claim text.