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US 12,568,577 B2Granted
Flexible copper-clad laminate and printed circuit made therefrom
AssigneeDupont Electronics, Inc.
InventorsShih-Ching Lin, Tung Lin Li
Life of this patent
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Abstract
Disclosed are surface-treated copper foils having at least one treated surface that exhibit high conductivity and a set of surface properties. Also provided are flexible copper-clad laminates and printed circuits made therefrom. The present printed circuits exhibit low insertion loss and are suitable for use in high speed/high frequency applications.
Claims6
A flexible copper-clad laminate, comprising:
- a surface-treated copper foil, characterized in that the surface-treated copper foil has an electric conductivity of 57.0×106 S/m or more, a cross-sectional average grain size of about 1 μm to about 2.5 μm, a thickness of about 3 μm to about 35 μm;
- and the surface-treated copper foil has a treated surface that has a surface roughness (Sz) of 3.0 μm or less, wherein the surface roughness (Sz) is measured at an outermost surface of the surface-treated copper foil according to ISO 25178;
- and
- a dielectric layer provided on the treated surface of the surface-treated copper foil, wherein:
- the dielectric layer has a thickness of about 5 μm to about 100 μm;
- the dielectric layer is composed of a layer of a polymeric material having a thermal decomposition temperature (1%) of 260° C. or higher;
- and
- the flexible copper-clad laminate has a peel strength of about 0.9 kN/m or more as measured according to IPC-TM 650.
5 more elements
Dependencies are inferred from the claim text.