Active metal brazing substrate material and method for producing the same

A method for producing an active metal brazing substrate material, comprising:

• performing a first brazing layer preparation operation, which includes:
• coating a first active solder paste on a side surface of a ceramic substrate layer, and drying the first active solder paste to form a first brazing layer;
• wherein the first active solder paste contains first active solder powders, and the first active solder powders include silver powders, copper powders, and first active metal powders;
• wherein, based on a total weight of the first active solder powders being 100 parts by weight, an amount of the silver powders is not less than 50 parts by weight;
• performing a second brazing layer preparation operation, which includes:
• coating a second active solder paste on a side surface of the first brazing layer away from the ceramic substrate layer, and drying the second active solder paste to form a second brazing layer;
• wherein the first brazing layer and the second brazing layer jointly form an active metal layer, the second active solder paste contains second active solder powders, the second active solder powders include low melting point metal powders, copper powders, and second active metal powders, and the low melting point metal powders have a melting point of between 130° C. and 350° C.;
• wherein, based on a total weight of the second active solder powders being 100 parts by weight, an amount of the low melting point metal powders is between 10 and 40 parts by weight, and the second active solder powders do not contain any silver powder;
• and
• performing a conductive metal layer preparation operation, which includes:
• disposing a conductive metal layer on a side surface of the second brazing layer away from the first brazing layer, and brazing the conductive metal layer onto the ceramic substrate layer through the active metal layer jointly formed by the first brazing layer and the second brazing layer under a high-temperature vacuum sintering process;
• wherein a sum of a thickness of the first brazing layer and a thickness of the second brazing layer is not less than 12 micrometers, the thickness of the first brazing layer is not less than 5 micrometers, and the thickness of the second brazing layer is not less than 10 micrometers.