Y10T 29/53187
Multiple station assembly apparatus
Y10T29/53187 (Multiple station assembly apparatus) appears on 402 US grants and 332 published applications in this corpus.
Search patents in Y10T- Granted patents
- 402
- Published applications
- 332
- Assignees
- 193
- Inventors
- 762
- Latest grant
- 8 Apr 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 5 | 0 |
| 1979 | 1 | 0 |
| 1980 | 7 | 0 |
| 1981 | 5 | 0 |
| 1982 | 3 | 0 |
| 1983 | 3 | 0 |
| 1984 | 3 | 0 |
| 1985 | 2 | 0 |
| 1986 | 4 | 0 |
| 1987 | 1 | 0 |
| 1988 | 4 | 0 |
| 1989 | 2 | 0 |
| 1990 | 5 | 0 |
| 1991 | 2 | 0 |
| 1992 | 3 | 0 |
| 1993 | 2 | 0 |
| 1994 | 4 | 0 |
| 1995 | 3 | 0 |
| 1996 | 5 | 0 |
| 1997 | 6 | 0 |
| 1998 | 9 | 0 |
| 1999 | 3 | 0 |
| 2000 | 4 | 0 |
| 2001 | 10 | 8 |
| 2002 | 10 | 22 |
| 2003 | 18 | 32 |
| 2004 | 19 | 33 |
| 2005 | 25 | 31 |
| 2006 | 32 | 37 |
| 2007 | 23 | 22 |
| 2008 | 23 | 31 |
| 2009 | 23 | 18 |
| 2010 | 25 | 14 |
| 2011 | 12 | 16 |
| 2012 | 14 | 19 |
| 2013 | 21 | 10 |
| 2014 | 18 | 5 |
| 2015 | 7 | 8 |
| 2016 | 5 | 4 |
| 2017 | 3 | 10 |
| 2018 | 7 | 7 |
| 2019 | 6 | 0 |
| 2020 | 5 | 3 |
| 2021 | 3 | 0 |
| 2022 | 1 | 1 |
| 2023 | 2 | 1 |
| 2024 | 0 | 0 |
| 2025 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Electronic device manufacturing system8 Apr 2025US 12,274,007 B2APPLIED Materials.Inc.
- Multi-station rotating terminal crimping machine head22 Aug 2023US 11,735,881 B2Shenzhen City Linquan Technology Co., Ltd
- Electronic device manufacturing system7 Feb 2023US 11,576,264 B2APPLIED Materials.Inc.
- Board working system30 Aug 2022US 11,432,449 B2Fuji Corporation
- Manufacturing station and manufacturing process21 Dec 2021US 11,203,090 B2KUKA Systems GmbH
- Electronic device manufacturing system21 Dec 2023US 2023/0413448 A1APPLIED Materials.Inc.
- Multi-station rotating terminal crimping machine head1 Sep 2022US 2022/0278493 A1Shenzhen City Linquan Technology Co., Ltd
- Electronic device manufacturing system28 May 2020US 2020/0170117 A1APPLIED Materials.Inc.
- Apparatus for combining printed circuit boards12 Mar 2020US 2020/0084925 A1Samsung Electronics Co., Ltd.
- Manufacturing station and manufacturing process16 Jan 2020US 2020/0016706 A1KUKA Systems GmbH
Most cited
By later US patents
- Backside method for fabricating semiconductor components with conductive interconnects311US 7,393,770 B2Micron Technology, Inc. · 2008
- Component mounting method167US 7,353,596 B2Matsushita Electric Industrial Co., Ltd. · 2008
- Component mounting apparatus163US 7,797,820 B2Panasonic Corporation · 2010
- Method of manufacturing electronic device including aligning first substrate, second substrate and mask, and transferring object from first substrate to second substrate, including irradiating object on first substrate with light through mask97US 7,127,810 B2Seiko Epson Corporation · 2006
- Electric-component mounting system92US 6,739,036 B2Fuji Machine Mfg. Co., Ltd. · 2004