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US 11,576,264 B2Granted
Electronic device manufacturing system
AssigneeApplied Materials, Inc.
InventorsMichael Robert Rice, Jeffrey C. Hudgens
Life of this patent
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Abstract
An electronic device manufacturing system includes a mainframe that includes a first transfer chamber and facets defining first side walls of the first transfer chamber. The facets include a first facet that has a first number of substrate access ports, a second facet that has a second number of substrate access ports, and a third facet that has the second number of substrate access ports. The second number of substrate access ports is different than the first number of substrate access ports.
Claims10
An electronic device manufacturing system comprising:
- a mainframe comprising a first transfer chamber and a plurality of facets defining first side walls of the first transfer chamber, wherein the plurality of facets comprises:
- a first facet that has a first number of substrate access ports;
- a second facet that has a second number of substrate access ports, wherein a first substrate access port of the first facet has a first side dimension (DIM) and a second substrate access port of the second facet has a second side DIM that is different from the first side DIM, and wherein the second facet is adjacent to the first facet;
- a third facet adjacent to the second facet;
- and
- a fourth facet that has the second number of substrate access ports, wherein the second number of substrate access ports is different than the first number of substrate access ports, wherein the first facet, the second facet, the third facet, and the fourth facet form the first transfer chamber.
3 more elements
Dependencies are inferred from the claim text.