Electronic device manufacturing system

An electronic device manufacturing system comprising:

• a mainframe comprising a first transfer chamber and a plurality of facets defining first side walls of the first transfer chamber, wherein the plurality of facets comprises:
• a first facet that has a first number of substrate access ports, wherein the first facet is configured to couple to a first quantity of process chambers;
• a second facet that has a second number of substrate access ports, wherein a first substrate access port of the first facet has a first side dimension and a second substrate access port of the second facet has a second side dimension that is different from the first side dimension, and wherein the second facet is adjacent to the first facet, wherein the second facet is configured to couple to a second quantity of process chambers;
• a third facet adjacent to the second facet, the third facet and the first facet having a first width;
• and
• a fourth facet that has the second number of substrate access ports, wherein the second number of substrate access ports is different than the first number of substrate access ports, the second facet and the fourth facet having a second width, wherein the first facet, the second facet, the third facet, and the fourth facet form the first transfer chamber.