Y10S 438/977
Thinning or removal of substrate
Y10S438/977 (Thinning or removal of substrate) appears on 941 US grants and 472 published applications in this corpus.
Search patents in Y10S- Granted patents
- 941
- Published applications
- 472
- Assignees
- 300
- Inventors
- 1,187
- Latest grant
- 5 Apr 2022
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 10 | 0 |
| 1977 | 7 | 0 |
| 1978 | 6 | 0 |
| 1979 | 1 | 0 |
| 1980 | 7 | 0 |
| 1981 | 5 | 0 |
| 1982 | 7 | 0 |
| 1983 | 5 | 0 |
| 1984 | 2 | 0 |
| 1985 | 7 | 0 |
| 1986 | 6 | 0 |
| 1987 | 2 | 0 |
| 1988 | 5 | 0 |
| 1989 | 13 | 0 |
| 1990 | 14 | 0 |
| 1991 | 6 | 0 |
| 1992 | 9 | 0 |
| 1993 | 22 | 0 |
| 1994 | 29 | 0 |
| 1995 | 24 | 0 |
| 1996 | 38 | 0 |
| 1997 | 45 | 0 |
| 1998 | 34 | 0 |
| 1999 | 46 | 0 |
| 2000 | 53 | 0 |
| 2001 | 48 | 21 |
| 2002 | 48 | 50 |
| 2003 | 39 | 52 |
| 2004 | 52 | 70 |
| 2005 | 46 | 48 |
| 2006 | 38 | 40 |
| 2007 | 40 | 29 |
| 2008 | 29 | 37 |
| 2009 | 41 | 27 |
| 2010 | 31 | 26 |
| 2011 | 30 | 18 |
| 2012 | 22 | 9 |
| 2013 | 16 | 9 |
| 2014 | 16 | 13 |
| 2015 | 13 | 5 |
| 2016 | 8 | 8 |
| 2017 | 7 | 2 |
| 2018 | 2 | 3 |
| 2019 | 6 | 3 |
| 2020 | 4 | 2 |
| 2021 | 0 | 0 |
| 2022 | 2 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Peeling method and method of manufacturing semiconductor device5 Apr 2022US 11,296,131 B2Semiconductor Energy Laboratory Co.Ltd.
- Laser diode array, method of manufacturing the same, printer, and optical communication device4 Jan 2022US RE48,880 E1Sony Group Corporation
- Semiconductor device fabrication method and semiconductor device20 Oct 2020US 10,811,512 B2Lapis Semiconductor Co., Ltd.
- Vertical structure LEDs24 Mar 2020US 10,600,933 B2LG Innotek Co., Ltd.
- Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays28 Jan 2020US 10,546,841 B2The Board of Trustees of the University of Illinois
- Peeling method and method of manufacturing semiconductor device14 May 2020US 2020/0152673 A1Semiconductor Energy Laboratory Co.Ltd.
- Vertical structure leds2 Jan 2020US 2020/0006593 A1LG Innotek Co., Ltd.
- Vertical structure leds10 Oct 2019US 2019/0312177 A1LG Innotek Co., Ltd.
- Semiconductor device fabrication method and semiconductor device6 Jun 2019US 2019/0172925 A1Lapis Semiconductor Co., Ltd.
- Vertical structure leds6 Jun 2019US 2019/0172974 A1LG Innotek Co., Ltd.
Most cited
By later US patents
- Three dimensional structure memory1,560US 5,915,167 AElm Technology Corporation · 1999
- Package of integrated circuits and vertical integration749US 6,322,903 B1Tru-Si Technologies, Inc. · 2001
- Smart-cut process for the production of thin semiconductor material films583US 5,882,987 AInternational Business Machines Corporation · 1999
- Method of manufacturing a semiconductor device using a metal which promotes crystallization of silicon and substrate bonding580US 5,821,138 ASemiconductor Energy Laboratory Co.Ltd. · 1998
- Method of making a three-dimensional integrated circuit501US 5,563,084 AFraunhofer-Gesellschaft zur F orderung der angewandten Forschung e.V. · 1996