Y10S 148/012
Bonding
Official title: Bonding, e.g. electrostatic for strain gauges
Y10S148/012 (Bonding) appears on 306 US grants and 33 published applications in this corpus.
Search patents in Y10S- Granted patents
- 306
- Published applications
- 33
- Assignees
- 101
- Inventors
- 414
- Latest grant
- 30 Jul 2019
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 3 | 0 |
| 1988 | 5 | 0 |
| 1989 | 9 | 0 |
| 1990 | 11 | 0 |
| 1991 | 12 | 0 |
| 1992 | 18 | 0 |
| 1993 | 27 | 0 |
| 1994 | 36 | 0 |
| 1995 | 46 | 0 |
| 1996 | 33 | 0 |
| 1997 | 27 | 0 |
| 1998 | 18 | 0 |
| 1999 | 15 | 0 |
| 2000 | 4 | 0 |
| 2001 | 7 | 2 |
| 2002 | 3 | 3 |
| 2003 | 0 | 1 |
| 2004 | 1 | 5 |
| 2005 | 4 | 1 |
| 2006 | 5 | 4 |
| 2007 | 0 | 0 |
| 2008 | 3 | 5 |
| 2009 | 2 | 1 |
| 2010 | 2 | 1 |
| 2011 | 2 | 1 |
| 2012 | 1 | 1 |
| 2013 | 0 | 0 |
| 2014 | 0 | 2 |
| 2015 | 1 | 2 |
| 2016 | 3 | 3 |
| 2017 | 1 | 1 |
| 2018 | 0 | 0 |
| 2019 | 2 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Three dimensional device integration method and integrated device30 Jul 2019US 10,366,962 B2Invensas Bonding Technologies, Inc.
- Method for low temperature bonding and bonded structure4 Jun 2019US 10,312,217 B2Invensas Bonding Technologies, Inc.
- Three dimensional device integration method and integrated device7 Feb 2017US 9,564,414 B2Ziptronix, Inc.
- Three dimensional device integration method and integrated device30 Aug 2016US 9,431,368 B2Ziptronix, Inc.
- Method for low temperature bonding and bonded structure12 Jul 2016US 9,391,143 B2Ziptronix, Inc.
- Three dimensional device integration method and integrated device15 Jun 2017US 2017/0170132 A1Ziptronix, Inc.
- Method for low temperature bonding and bonded structure3 Nov 2016US 2016/0322328 A1Ziptronix, Inc.
- Three dimensional device integration method and integrated device30 Jun 2016US 2016/0190093 A1Ziptronix, Inc.
- Method for low temperature bonding and bonded structure24 Mar 2016US 2016/0086913 A1Ziptronix, Inc.
- Method for low temperature bonding and bonded structure22 Oct 2015US 2015/0303263 A1Ziptronix, Inc.
Most cited
By later US patents
- Process for the production of thin semiconductor material films1,233US 5,374,564 ACommissariat A L' Energie Atomique · 1994
- Process for manufacturing three dimensional IC's337US 5,266,511 AFujitsu Limited · 1993
- Process of making semiconductor-on-insulator substrate331US 5,670,411 ACanon Kabushiki Kaisha · 1997
- Semiconductor device substrate and process for preparing the same329US 5,277,748 ACanon Kabushiki Kaisha · 1994
- Method of bonding wafers having vias including conductive material314US 5,646,067 AHarris Corporation · 1997