H10P 10/1285
By bonding laterally separated doped regions to each other
Official title: {by bonding laterally separated doped regions to each other}
H10P10/1285 (By bonding laterally separated doped regions to each other) appears on 2 US grants and 3 published applications in this corpus.
Search patents in H10P- Granted patents
- 2
- Published applications
- 3
- Assignees
- 4
- Inventors
- 12
- Latest grant
- 17 Feb 2004
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2002 | 1 | 0 |
| 2003 | 0 | 1 |
| 2004 | 1 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 0 |
| 2024 | 0 | 1 |
| 2025 | 0 | 1 |
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Recent patents
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- Super-junction semiconductor device and the method of manufacturing the same9 Jan 2003US 2003/0008483 A1Fuji Electric Co., Ltd.
Most cited
By later US patents