H10N 39/00
Integrated devices, or assemblies of multiple devices, comprising at least one piezoelectric
Official title: Integrated devices, or assemblies of multiple devices, comprising at least one piezoelectric, electrostrictive or magnetostrictive element covered by groups H10N30/00 – H10N35/00
H10N39/00 (Integrated devices, or assemblies of multiple devices, comprising at least one piezoelectric) appears on 556 US grants and 669 published applications in this corpus.
Search patents in H10N- Granted patents
- 556
- Published applications
- 669
- Assignees
- 306
- Inventors
- 1,420
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 2 | 0 |
| 1985 | 3 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 5 | 0 |
| 1990 | 1 | 0 |
| 1991 | 4 | 0 |
| 1992 | 1 | 0 |
| 1993 | 6 | 0 |
| 1994 | 5 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 6 | 0 |
| 1998 | 5 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 3 | 0 |
| 2002 | 3 | 6 |
| 2003 | 3 | 13 |
| 2004 | 9 | 20 |
| 2005 | 8 | 9 |
| 2006 | 8 | 12 |
| 2007 | 8 | 10 |
| 2008 | 9 | 10 |
| 2009 | 8 | 13 |
| 2010 | 7 | 14 |
| 2011 | 13 | 15 |
| 2012 | 11 | 19 |
| 2013 | 18 | 14 |
| 2014 | 18 | 23 |
| 2015 | 17 | 27 |
| 2016 | 20 | 19 |
| 2017 | 18 | 33 |
| 2018 | 24 | 43 |
| 2019 | 31 | 59 |
| 2020 | 46 | 50 |
| 2021 | 38 | 61 |
| 2022 | 40 | 49 |
| 2023 | 48 | 40 |
| 2024 | 27 | 42 |
| 2025 | 44 | 41 |
| 2026 | 26 | 27 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- MEMS resonator6 Oct 2026US 12,753,070 B2SiTime Corporation
- Acoustic wave clock distribution18 Aug 2026US 12,712,518 B2Intel Corporation
- Piezoelectric stack, method of manufacturing piezoelectric stack, and piezoelectric element18 Aug 2026US 12,713,833 B2Sumitomo Chemical Company, Limited
- Integration techniques for micromachined pMUT arrays and electronics using solid liquid interdiffusion (SLID)11 Aug 2026US 12,704,626 B2Exo Imaging, Inc.
- Electronic apparatus11 Aug 2026US 12,707,896 B2Samsung Display Co., Ltd.
- Method for manufacturing array sensor element and array sensor element1 Oct 2026US 2026/0305173 A1Seiko Epson Corporation
- Hybrid documents1 Oct 2026US 2026/0305474 A1X-Celeprint Limited
- Memory device24 Sep 2026US 2026/0293151 A1Kioxia Corporation
- Ultrasound and magnetic field used with magneto-elastic material for determinng tissue engagement by medical device20 Aug 2026US 2026/0240605 A1Koninklijke Philips N. V.
- Reconfigurable systems by shifting materials inside a cavity20 Aug 2026US 2026/0247866 A1APPLIED Materials.Inc.
Most cited
By later US patents
- Fully integrated single-crystal silicon-on-insulator process, sensors and circuits261US 5,343,064 A1994
- Single chip device for voice communications223US 6,664,713 B22003
- Micromechanical structure173US 5,252,294 AMesserschmitt-Bolkow-Blohm GmbH · 1993
- Fingerprint sensor144US 4,429,413 ASiemens Aktiengesellschaft · 1984
- High frequency oscillator comprising cointegrated thin film resonator and active device129US 5,075,641 AIowa State University Research Foundation, Inc. · 1991