Single chip device for voice communications
OwnerPeter V. Boeseninventor
Life of this patent
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Abstract
The present invention is a chip for use in a voice communication device. The chip provides for both bone conduction sensing and air conduction sensing. The chip includes a bone conduction sensing pattern disposed within the chip and a microphone sensing pattern disposed within the chip. In addition, the chip can optionally include an integrated circuit portion interconnected to the bone conduction sensing pattern and the microphone sensing pattern. The pattern can be of a piezoelectric polymer, the patterns overlaying the substrate. Preferably, the bone conduction sensing pattern and the microphone sensing pattern are placed on opposite ends of the chip.
Claims8
A chip for use in a voice communication device comprising:
- a bone conduction sensing pattern disposed within the chip;
- and
- a microphone sensing pattern disposed within the chip.
A chip for use in a voice communication device comprising:
- a substrate;
- a piezoelectric polymer overlaying the substrate;
- the piezoelectric polymer having a first pattern and a second pattern, the first pattern being an accelerometer sensor pattern and the second pattern being a microphone sensor pattern.
A voice communication device comprising:
- a chip having a microphone sensor and an accelerometer.
Dependencies are inferred from the claim text.