H10K 19/201
Integrated devices having a three-dimensional layout
Official title: {Integrated devices having a three-dimensional layout, e.g. 3D ICs}
H10K19/201 (Integrated devices having a three-dimensional layout) appears on 20 US grants and 32 published applications in this corpus.
Search patents in H10K- Granted patents
- 20
- Published applications
- 32
- Assignees
- 24
- Inventors
- 67
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2010 | 0 | 2 |
| 2011 | 0 | 2 |
| 2012 | 0 | 2 |
| 2013 | 2 | 0 |
| 2014 | 1 | 1 |
| 2015 | 2 | 0 |
| 2016 | 0 | 2 |
| 2017 | 0 | 0 |
| 2018 | 1 | 1 |
| 2019 | 1 | 3 |
| 2020 | 2 | 2 |
| 2021 | 1 | 0 |
| 2022 | 1 | 3 |
| 2023 | 2 | 7 |
| 2024 | 4 | 3 |
| 2025 | 2 | 2 |
| 2026 | 1 | 2 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Semiconductor device18 Aug 2026US 12,713,632 B2Samsung Electronics Co., Ltd.
- 3D processor having stacked integrated circuit die26 Aug 2025US 12,401,010 B2Adeia Semiconductor Inc.
- Three-dimensional semiconductor memory devices4 Feb 2025US 12,219,768 B2Samsung Electronics Co., Ltd.
- 3D micro display device and structure17 Sep 2024US 12,094,892 B2Monolithic 3D Inc.
- Organic molecular memory25 Jun 2024US 12,022,669 B2Kioxia Corporation
- Organic molecular memory24 Sep 2026US 2026/0293411 A1
- 3d processor having stacked integrated circuit die16 Jul 2026US 2026/0206646 A1Adeia Semiconductor Inc.
- Three-dimensional semiconductor memory devices24 Apr 2025US 2025/0133739 A1Samsung Electronics Co., Ltd.
- Monolithic integration of vertical electrochemical transistors20 Mar 2025US 2025/0098393 A1Northwestern University
- Electronic element comprising a plurality of cells arranged in a three dimensional array of cells and method for producing such an electronic device14 Nov 2024US 2024/0381674 A1Merck Patent GmbH
Most cited
By later US patents
- 3D processor25US 10,672,745 B2Xcelsis Corporation · 2020
- 3D static RAM core cell having vertically stacked structure, and static RAM core cell assembly comprising same6US 10,692,935 B2Center for Advanced Soft Electronics · 2020
- Integrated circuits and systems and methods for producing the same6US 8,963,135 B2Intel Corporation · 2015
- 3D processor having stacked integrated circuit die3US 11,152,336 B2Xcelsis Corporation · 2021
- Three-dimensional semiconductor memory devices3US 11,404,429 B2Samsung Electronics Co., Ltd. · 2022