H10H 29/8508
Package substrates
Official title: {Package substrates, e.g. submounts}
H10H29/8508 (Package substrates) appears on 51 US grants and 182 published applications in this corpus.
Search patents in H10H- Granted patents
- 51
- Published applications
- 182
- Assignees
- 72
- Inventors
- 475
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2007 | 0 | 1 |
| 2008 | 0 | 2 |
| 2009 | 0 | 2 |
| 2010 | 2 | 2 |
| 2011 | 2 | 1 |
| 2012 | 1 | 2 |
| 2013 | 1 | 3 |
| 2014 | 2 | 2 |
| 2015 | 2 | 1 |
| 2016 | 3 | 1 |
| 2017 | 0 | 1 |
| 2018 | 1 | 3 |
| 2019 | 2 | 2 |
| 2020 | 2 | 2 |
| 2021 | 2 | 4 |
| 2022 | 3 | 5 |
| 2023 | 4 | 12 |
| 2024 | 4 | 18 |
| 2025 | 10 | 44 |
| 2026 | 10 | 74 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Unit pixel having light emitting device and displaying apparatus6 Oct 2026US 12,757,559 B2Seoul Viosys Co., Ltd.
- Single-layer printed circuit board for a lighting device18 Aug 2026US 12,710,144 B2Lutron Technology Company LLC
- Light emitting diode wired to zener diode9 Jun 2026US 12,652,895 B2Rohm Co., Ltd.
- Micro integrated circuit with integrated micro light-emitting diode display laminated into glass2 Jun 2026US 12,648,492 B2GM Global Technology Operations LLC
- Chip lamp bead and luminaire12 May 2026US 12,628,488 B1Shangyou Jiayi Lighting Product Co., Ltd.
- Manufacturing method of a led array precursor with electrical contacts on same side, corresponding precursor, led array and devices comprising the same8 Oct 2026US 2026/0314139 A1Polar Light Technologies AB
- Lighting emitting diode package structure1 Oct 2026US 2026/0305045 A1Ennostar Corporation
- Light-emitting substrate, light-emitting apparatus, and display apparatus24 Sep 2026US 2026/0293402 A1BOE MLED Technology Co., Ltd.
- Display device, manufacturing method of the same, and electronic device comprising the same17 Sep 2026US 2026/0282638 A1Samsung Display Co., Ltd.
- Method for processing an arrangement having µleds and arrangement10 Sep 2026US 2026/0271450 A1
Most cited
By later US patents
- Light emitting device package including UV light emitting diode20US 8,669,581 B2LG Innotek Co., Ltd. · 2014
- Light emitting element and illumination device thereof12US 9,123,868 B2Formosa Epitaxy Incorporation · 2015
- Micro-LED transfer method and manufacturing method7US 10,566,494 B2Goertek Inc. · 2020
- Flexible lighting device6US 9,136,441 B2Grote Industries, Inc. · 2015
- Housing body and method for production thereof3US 8,288,791 B2OSRAM Opto Semiconductors GmbH · 2012