Housing body and method for production thereof

A package body with an upper side, with an underside, opposite from the upper side, and with a side surface, which connects the upper side and the underside and is provided as a mounting surface, the package body having a plurality of layers which contain a ceramic material, wherein a main direction of extent of the plurality of layers extends transversely in relation to the mounting surface, wherein the package body comprises a first electrically conducting chip connection area arranged on a first layer of the plurality of layers and a second electronically conducting chip connection area arranged on a second layer of the plurality of layers, and wherein the package body has a via hole which extends from the upper side to the underside, and wherein the via hole extends along the mounting surface.