Micro integrated circuit with integrated micro light-emitting diode display laminated into glass

A laminated glass panel comprising:

• an outer glass layer;
• an inner glass layer;
• a bonding layer between the outer glass layer and the inner glass layer;
• a display unit embedded in a first surface of the laminated glass panel, the display unit comprising a plurality of pixels, each pixel comprising:
• a micro integrated circuit (IC) comprising a driving circuit;
• and
• a micro light-emitting diode (LED) on a surface of the driving circuit;
• and
• a plurality of sensor units embedded in a second surface of the laminated glass panel opposite and facing the first surface, the plurality of sensor units alternating with the plurality of pixels;
• wherein the first surface is free of sensor units and the second surface is free of pixels.

A method for integrating micro integrated circuits with micro light-emitting diodes in laminated glass assemblies, the method comprising:

• forming one or more first glass layers;
• forming one or more first bus lines on the one or more first glass layers;
• forming a display unit on the one or more first bus lines, the display unit comprising a plurality of pixels, each pixel comprising:
• a micro integrated circuit (IC) comprising a driving circuit;
• and
• a micro light-emitting diode (LED) on a surface of the driving circuit;
• forming a bonding layer over the display unit and the one or more first glass layers;
• forming one or more second glass layers over the bonding layer, the one or more second glass layers comprising one or more second bus lines;
• forming a plurality of sensor units on the one or more second bus lines, the plurality of sensor units alternating with the plurality of pixels;
• and
• laminating the one or more first glass layers, the bonding layer, and the one or more second glass layers to define a laminated glass assembly;
• wherein the first surface is free of sensor units and the second surface is free of pixels.