Micro-LED transfer method and manufacturing method
AssigneeGoertek Inc.
InventorQuanbo Zou
Life of this patent
Estimating the term…
Abstract
A micro-LED transfer method and a manufacturing method are disclosed. The micro-LED transfer method comprises: coating a sacrificial layer on a carrier substrate, wherein micro-LEDs are bonded on the carrier substrate through a first bonding layer (S1100); patterning the sacrificial layer to expose micro-LEDs to be picked up (S1200); bonding the micro-LEDs to be picked up with a pickup substrate through a second bonding layer (S1300); removing the sacrificial layer by undercutting (S1400); lifting-off the micro-LEDs to be picked up from the carrier substrate (S1500); bonding the micro-LEDs on the pickup substrate with a receiving substrate through a third bonding layer (S1600); and lifting-off the micro-LEDs from the pickup substrate (S1700).
Claims10
A micro-LED transfer method, the method comprising the steps of:
- coating a sacrificial layer on a carrier substrate, wherein micro-LEDs are bonded on the carrier substrate through a first bonding layer;
- exposing a first portion of the micro-LEDs to be picked up by patterning the sacrificial layer, while a second portion of the micro-LEDs is coated by the sacrificial layer;
- bonding the first portion of the micro-LEDs to be picked up with a pickup substrate through a second bonding layer;
- removing the sacrificial layer by undercutting;
- lifting-off the first portion of the micro-LEDs to be picked up from the carrier substrate by heating the first bonding layer at a first temperature;
- bonding the first portion of the micro-LEDs on the pickup substrate with a receiving substrate through a third bonding layer;
- and
- lifting-off the first portion of the micro-LEDs from the pickup substrate by heating the second bonding layer at a second temperature,
- wherein the first temperature is lower than the second temperature.
Dependencies are inferred from the claim text.