Lighting emitting diode package structure

Abstract

The present disclosure provides a light emitting diode package, which includes an insulating layer, a plurality of light emitting diodes, a circuit layer, a plurality of bonding pads, and a light conversion layer. The insulating layer has a process working region, and an area of the process working region is 2% to 50% of an area of the insulating layer. The light emitting diodes are embedded in the insulating layer, and the light emitting diodes are arranged around the process working region. The circuit layer is embedded in the insulating layer and electrically connected to the light emitting diodes. The bonding pads are disposed under the insulating layer and electrically connected to the circuit layer. The light conversion layer is disposed on the insulating layer. The process working region overlaps with a geometric center of the light emitting diode package in a top view.

Dependencies are inferred from the claim text.