H10H 20/857
Interconnections
Official title: Interconnections, e.g. lead-frames, bond wires or solder balls
H10H20/857 (Interconnections) appears on 12,418 US grants and 16,401 published applications in this corpus.
Search patents in H10H- Granted patents
- 12,418
- Published applications
- 16,401
- Assignees
- 1,751
- Inventors
- 14,875
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 7 | 0 |
| 1978 | 3 | 0 |
| 1979 | 2 | 0 |
| 1980 | 3 | 0 |
| 1981 | 3 | 0 |
| 1982 | 3 | 0 |
| 1983 | 2 | 0 |
| 1984 | 4 | 0 |
| 1985 | 3 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 5 | 0 |
| 1989 | 3 | 0 |
| 1990 | 7 | 0 |
| 1991 | 8 | 0 |
| 1992 | 6 | 0 |
| 1993 | 7 | 0 |
| 1994 | 7 | 0 |
| 1995 | 5 | 0 |
| 1996 | 6 | 0 |
| 1997 | 7 | 0 |
| 1998 | 15 | 0 |
| 1999 | 10 | 0 |
| 2000 | 21 | 0 |
| 2001 | 23 | 19 |
| 2002 | 34 | 68 |
| 2003 | 54 | 60 |
| 2004 | 60 | 108 |
| 2005 | 57 | 165 |
| 2006 | 82 | 178 |
| 2007 | 88 | 227 |
| 2008 | 104 | 248 |
| 2009 | 118 | 260 |
| 2010 | 208 | 373 |
| 2011 | 257 | 472 |
| 2012 | 300 | 485 |
| 2013 | 376 | 577 |
| 2014 | 507 | 633 |
| 2015 | 581 | 792 |
| 2016 | 680 | 756 |
| 2017 | 747 | 896 |
| 2018 | 723 | 971 |
| 2019 | 969 | 1062 |
| 2020 | 921 | 1136 |
| 2021 | 843 | 1291 |
| 2022 | 859 | 1512 |
| 2023 | 803 | 1419 |
| 2024 | 981 | 1370 |
| 2025 | 1166 | 901 |
| 2026 | 735 | 422 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Curved semiconductor chip and method for forming the same8 Oct 2026US 2026/0314120 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Light emitting device8 Oct 2026US 2026/0314134 A1Nichia Corporation
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Most cited
By later US patents
- Optical systems fabricated by printing-based assembly564US 7,972,875 B2The Board of Trustees of the University of Illinois · 2011
- High efficiency light emitting diodes from bipolar gallium nitride558US 5,210,051 ACree Research, Inc. · 1993
- Light emitting diode package522US 7,709,857 B2Samsung Electro-Mechanics Co., Ltd. · 2010
- Semiconductor light emitting device, method of manufacturing the same, and semiconductor light emitting device package using the same495US 7,964,881 B2Samsung LED Co., Ltd. · 2011
- Chip coated light emitting diode package and manufacturing method thereof486US 8,324,646 B2Samsung Electronics Co., Ltd. · 2012